| Allicdata Part #: | ATS-04H-199-C1-R0-ND |
| Manufacturer Part#: |
ATS-04H-199-C1-R0 |
| Price: | $ 3.19 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X6MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04H-199-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.90052 |
| 30 +: | $ 2.82240 |
| 50 +: | $ 2.66553 |
| 100 +: | $ 2.50872 |
| 250 +: | $ 2.35192 |
| 500 +: | $ 2.27352 |
| 1000 +: | $ 2.03833 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.80°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks, such as the ATS-04H-199-C1-R0, are used to absorb and dissipate heat from electrical components, such as transistors, diodes and integrated circuits. These devices utilize fan modules, heat pipes, and heat sinks to ensure that the internal components of the device remain safe and cool. The ATS-04H-199-C1-R0 is designed to work in either an active or passive mode, allowing for maximum flexibility in the application.
In active mode, the ATS-04H-199-C1-R0 utilizes a fan module to actively cool the components by displacing heat through the use of a convective airflow. The fan module draws in air and rapidly circulates it around the components of the device, thus aiding convection and effectively removing the heat from the components. Heat is then dissipated either to the environment or to a radiator.
In passive mode, the ATS-04H-199-C1-R0 utilises a combination of different techniques to ensure that the heat is effectively dissipated. Heat pipes are used to transfer thermal energy from one area to another, while heat sinks are utilized to absorb radiation and conduct heat away from the device. In addition, the device has small fins to aid in the convection of air.
The ATS-04H-199-C1-R0 can be used in a variety of applications, such as computers, communications systems, medical apparatus, and a whole range of other industries. It is particularly useful in high-performance computing, where it ensures that the components can be kept cool and operate at maximum efficiency. It is also excellent in high-temperature environments, such as PLCs (Programmable Logic Controllers) and other industrial applications.
The ATS-04H-199-C1-R0 is a versatile and efficient thermal management device. It offers excellent performance and is highly reliable, making it an ideal choice for a wide range of applications. This device has been designed to work in both active and passive modes, allowing for maximum flexibility in its use. With its efficient heat transfer and dissipation capabilities, this heat sink provides an effective solution for many thermal management needs.
The specific data is subject to PDF, and the above content is for reference