ATS-04H-27-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-04H-27-C3-R0-ND

Manufacturer Part#:

ATS-04H-27-C3-R0

Price: $ 7.24
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 70X70X12.7MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04H-27-C3-R0 datasheetATS-04H-27-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 6.51231
30 +: $ 6.15027
50 +: $ 5.78857
100 +: $ 5.42676
250 +: $ 5.06498
500 +: $ 4.70319
1000 +: $ 4.61275
Stock 1000Can Ship Immediately
$ 7.24
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.756" (70.00mm)
Width: 2.756" (70.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 12.28°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are an unavoidable component in all types of electronic devices, from personal computers to industrial components used in manufacturing and engineering. The use of these sinks is essential to ensure effective and safe operation of the devices. This article will focus on the ATS-04H-27-C3-R0 Heat Sink, its application field and how it works.

The ATS-04H-27-C3-R0 Heat Sink is an aluminized thermal solution and is suitable for applications requiring thermal insulation and Heat dissipation in electrical products. It is designed to be lightweight and efficient, making it a great choice for a variety of applications. The Heat Sink has a good thermal conductivity and is fairly resistant to corrosion, making it suitable for both indoor and outdoor use.

The ATS-04H-27-C3-R0 Heat Sink is used mainly in computer systems, consumer electronics, and lighting fixtures. It helps to dissipate heat generated by the processor, RAM, and other components of the computer, helping to keep the system running at optimal performance. It also helps to protect other components from heat by providing a thermal barrier to separate the hot and cold components of the system. The Heat Sink also acts as a shield to prevent the heat from reaching other sensitive components, which helps to ensure a longer life for the device.

In terms of application field, the ATS-04H-27-C3-R0 Heat Sink is used in the production of any device that uses a bipolar transistor or other semiconductor devices that generate heat while working. Bipolar transistors generate a large amount of heat during the operation, which must be dissipated into the surrounding environment. The ATS-04H-27-C3-R0 Heat Sink is a good choice to efficiently dissipate this heat in order to ensure the efficient and safe operation of the device.

The working principle behind the ATS-04H-27-C3-R0 Heat Sink is quite simple. The heat generated by the electronic device is absorbed by the metal fins of the Heat Sink, which act as a heat sink to draw the heat away from the electronic component and into the surrounding environment. The fins of the Heat Sink draw the heat away from the device, providing a cooling effect which helps to ensure the efficient and safe operation of the device.

The ATS-04H-27-C3-R0 Heat Sink is a versatile and useful thermal solution for many electronic devices. It helps to dissipate heat generated by the device, providing efficient cooling for the components and protecting them from damage caused by excessive heat. Additionally, the ATS-04H-27-C3-R0 Heat Sink is corrosion resistant and lightweight, making it suitable for various applications.

The specific data is subject to PDF, and the above content is for reference

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