| Allicdata Part #: | ATS8937-ND |
| Manufacturer Part#: |
ATS-04H-60-C2-R0 |
| Price: | $ 4.63 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04H-60-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.20840 |
| 10 +: | $ 4.09437 |
| 25 +: | $ 3.86719 |
| 50 +: | $ 3.63964 |
| 100 +: | $ 3.41221 |
| 250 +: | $ 3.18473 |
| 500 +: | $ 2.95725 |
| 1000 +: | $ 2.90037 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.36°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat Sinks are an essential component of many electronic designs. Whether you are designing a system for a high-end gaming computer or for a medical device, heat sinks are an excellent way to optimize the thermal characteristics of a device. The ATS-04H-60-C2-R0 is a thermal solution with superior thermal performance and excellent integration capabilities. It is suitable for use in a variety of applications, such as passive cooling or active fan cooling systems.
The ATS-04H-60-C2-R0 is a standard 60mm x 60mm size fan-less heat sink. It is constructed from a single piece of aluminum alloy that is machined to achieve its precise dimensions. On the top, the heat sink features four pre-soldered spring-loaded pins, which mate with the four mounting holes on the motherboard or other circuit board. The bottom of the heat sink has a thermal adhesive that ensures a secure connection with the device being cooled.
The ATS-04H-60-C2-R0 is designed with a special geometry that increases the surface area available for efficient heat dissipation. The heat sink features a rectangular design with vertical fins that create a continuous area of contact between the heat sink and the device being cooled. These fins increase the overall surface area, which results in increased heat dissipation compared to traditional heat sinks. Also, the heat sink has an optimized airflow design that eliminates dead spots when the cooling fan is attached. This helps ensure a uniform temperature distribution across the system during operation.
The ATS-04H-60-C2-R0 is a highly efficient thermal solution for any electronic device. It takes advantage of the cooling properties of aluminum alloy to provide superior thermal performance compared to traditional heat sinks. The optimized design of the fins ensures efficient heat transfer, while the thermal adhesive on the bottom ensures secure connection to the device. This allows for improved system performance and longer device lifespans. The ATS-04H-60-C2-R0 is an excellent choice for any application where reliable, efficient thermal performance is needed.
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