| Allicdata Part #: | ATS-04H-61-C3-R0-ND |
| Manufacturer Part#: |
ATS-04H-61-C3-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04H-61-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.23358 |
| 50 +: | $ 3.04340 |
| 100 +: | $ 2.85314 |
| 250 +: | $ 2.66293 |
| 500 +: | $ 2.47272 |
| 1000 +: | $ 2.42517 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 22.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-Heat Sinks are an important element of any electronic system. They are used to manage the thermal characteristics of components and systems. The ATS-04H-61-C3-R0 is a popular, high-performance heat sink that is designed to facilitate efficient heat transfer from electronic components and systems to the environment. This type of heat sink is widely used in a range of applications, from consumer electronics to specialized industrial electronics.
The ATS-04H-61-C3-R0 has a high level of performance and is designed to provide excellent cooling capabilities for a variety of electronics. This type of heat sink is constructed from a high-grade aluminum alloy with a special surface finish that helps to increase the cooling capability. The material is also designed to produce improved surface contact with the electronic component, which helps to further increase the effectiveness of the cooling system.
The design of the ATS-04H-61-C3-R0 helps to ensure that it has the highest level of air flow, which improves its efficiency and thermal characteristics. The fins of the heat sink are designed to provide maximum heat dissipation. They are also designed to disperse heat more evenly across the entire surface area. The heat sink also uses large fans to help enhance air flow and further improve the cooling capabilities.
The ATS-04H-61-C3-R0 has a wide range of applications. It is commonly used in consumer electronics such as laptop computers, desktop PCs, and game consoles. It is also used in medical devices, as well as industrial applications. The heat sink is capable of dissipating large amounts of heat in a short period of time, which makes it ideal for applications that require high levels of cooling.
The ATS-04H-61-C3-R0 works on the principle of thermal conduction. This means that heat is transferred from one component to another through the heat transfer medium. The heat sink acts as a conductor, allowing heat to move from the device to the fins, and then out into the surrounding environment. This helps to keep the device cool and operating at optimum temperatures.
The ATS-04H-61-C3-R0 also features a three-part design. The first part is a base plate, which is designed to provide support for the heat sink and help reduce the risk of heat dissipation. The second part is a fan, which is designed to increase the air flow and further improve the cooling capabilities. The third part is a set of fins, which are designed to increase the amount of surface area that is exposed to the air and help dissipate the heat from the device more efficiently.
The ATS-04H-61-C3-R0 is an efficient and reliable thermal-heatsink. Its high level of performance and design features make it an ideal choice for a variety of applications. It provides excellent cooling capabilities and is designed to handle large amounts of heat in a short period of time. This makes it an excellent choice for applications that require efficient thermal management.
The specific data is subject to PDF, and the above content is for reference