Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	12.29°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Technical Overview of ATS-04H-63-C1-R0 Heat Sink

Heatsinks are device used to regulate the temperature of a system by dissipating heat away from components and other equipment. Heat sinks are made of metallic material and are usually connected to the system in order to carry heat away from the components and other equipment with thermal conduction.The ATS-04H-63-C1-R0 heat sink is a high-performance, long-life heat sink that provides efficient cooling and thermal protection of electronic components and systems. This heat sink is constructed with extruded aluminum profile and aluminum alloy fins, providing excellent heat exchange characteristics and superior cooling to the device it is connected to.

Design

The heat sink is designed with an extended finned area and height, making it suitable for use on a range of thermal applications. The fins can be adjusted to a specific configuration, providing the maximum surface area for heat dissipation. Additionally, the heat sink can be used either horizontally or vertically, depending upon the construction and airflow arrangements.

Related Components

The ATS-04H-63-C1-R0 heat sink is typically used with a combination of other components in order to provide an efficient cooling solution. These include fans, heat spreaders and other passive devices such as heatsinks, heat exchangers and thermal management systems.The heat sink is used to connect with the cooling device, and to transfer heat to the other components, such as the fan, heat exchanger, or thermal management system. The cooling device, such as a fan, is used to create a flow of air around the components of the system, which helps to dissipate heat more rapidly.

Applications

The ATS-04H-63-C1-R0 heat sink is a device that can be used in a wide range of applications, including automotive, aerospace, and power generation. In automotive applications, the heat sink helps to protect electronic components from the harsh environment and to maintain a balance of temperatures. In aerospace applications, the heat sink is used to protect avionics components and systems from the extreme temperatures as the aircraft flies through the atmosphere at high speeds. Additionally, the heat sink is used in power generation, where it helps to keep components and other equipment cool in high power systems.

Working Principle

The ATS-04H-63-C1-R0 heat sink draws heat away from the components by using thermal conduction. The fins are made of an aluminum alloy, which helps to conduct heat away from the heat source and into the surrounding environment. The fins are connected to the heat sink via thermal conduction and absorb the heat from the electronic components or systems. The fin configuration and construction of the ATS-04H-63-C1-R0 heat sink are designed for maximum thermal conduction, allowing the heat to transfer to the environment quickly and efficiently. The fins are aligned in a special configuration, which helps to increase heat transfer rates, and to contribute to the overall performance of the heat sink.

Conclusion

The ATS-04H-63-C1-R0 heat sink is an efficient, long-life heat sink that provides excellent cooling of electronic components and systems. The construction of the heat sink features an extended finned area, maximizing the surface area available for heat dissipation. Additionally, the heat sink is designed for use in a range of applications, including automotive, aerospace, and power generation. The heat sink utilizes thermal conduction to efficiently draw heat away from the components and other devices it is connected to.

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