| Allicdata Part #: | ATS-04H-73-C1-R0-ND |
| Manufacturer Part#: |
ATS-04H-73-C1-R0 |
| Price: | $ 3.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04H-73-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.81736 |
| 30 +: | $ 2.74134 |
| 50 +: | $ 2.58905 |
| 100 +: | $ 2.43671 |
| 250 +: | $ 2.28446 |
| 500 +: | $ 2.20830 |
| 1000 +: | $ 1.97985 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 28.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks refers to a device that is designed to absorb heat from its surroundings and transfer it to the air or another substance such as a liquid, thereby dissipating the heat from the structures they protect. Heat sinks are typically used to cool electronic components and may take the form of a passive, active or dynamic heat sinks which contribute to a cooler operating environment and maximize the life of the component. The ATS-04H-73-C1-R0 is a specific type of heat sink which has an extendable design that can be applied to a variety of applications and principles. In this article, we will discuss the application field and working principle of the ATS-04H-73-C1-R0.
The ATS-04H-73-C1-R0 heat sink is a high-performance component for industrial and consumer fixtures that require maximum cooling efficiency and reliability. Its extendable design, easy installation and low profile make it ideal for places where space is limited. It has been constructed from quality materials so as to ensure effective heat transfer between the device and the environment. Additionally, the device has an optimal cooling capacity of 9 CFM that ensures maximum air cooling for applications like industrial lighting, HVAC systems, medical equipment, automotive, inverters and much more.
The ATS-04H-73-C1-R0 is able to dissipate the heat from its surroundings efficiently due to its simple working principle. The device operates by the heat in its environment being absorbed by the fins of the heat sink which can then be converted to thermal energy via conduction. This thermal energy then radiates outwards from the fins and is absorbed by the surrounding air or liquid, thus cooling the components and dissipating the heat away.
The ATS-04H-73-C1-R0 is a versatile and reliable heat sink that can be used for a variety of applications. It is an ideal solution for fans, LEDs, DC power supplies, audio/video equipment, computers, CNC machines, communication systems, vehicles, and more. The device can also be used in various industrial applications where heat dissipation is essential. The device is also suited for applications that require high cooling efficiency such as HVAC, refrigeration, and computer equipment.
Furthermore, the ATS-04H-73-C1-R0 is also designed to be used in domestic applications such as air conditioners, refrigerators, geysers, etc. as it can effectively dissipate heat from its surroundings. Additionally, the device is also suitable for applications that require temperature reduction such as in cases of smelting, welding, and various other metals working tasks.
As a conclusion, the ATS-04H-73-C1-R0 is a robust and well-designed heat sink that has many advantages. Its extendable design, easy installation, and low profile make it achievable to install in places where space is limited, while its high cooling efficiency allows it to dissipate heat effectively in a variety of applications. From industrial lighting to HVAC systems, the ATS-04H-73-C1-R0 can be used to optimize the performance of many components.
The specific data is subject to PDF, and the above content is for reference