| Allicdata Part #: | ATS-04H-97-C3-R0-ND |
| Manufacturer Part#: |
ATS-04H-97-C3-R0 |
| Price: | $ 4.00 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04H-97-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.64329 |
| 30 +: | $ 3.44106 |
| 50 +: | $ 3.23870 |
| 100 +: | $ 3.03629 |
| 250 +: | $ 2.83387 |
| 500 +: | $ 2.63145 |
| 1000 +: | $ 2.58084 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.39°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-04H-97-C3-R0 thermal-heat sink is the next major step forward in thermal management solutions. Designed for high-end applications, it combines advanced heat-dissipation techniques and efficient airflow management to provide superior thermal performance. The design allows for extremely high power dissipation capability, low thermal resistance, and the ability to quickly and effectively dissipate potentially high levels of heat.
An important factor in the design of the ATS-04H-97-C3-R0 is the use of an aluminum-extruded fin to optimize heat dissipation. The fin design increases the total surface area, allowing for more efficient heat transfer. Additionally, the fin surface has been designed with the help of computational fluid dynamics (CFD) simulations, allowing for optimal air dynamics. The fin is also anodized for additional corrosion protection.
The thermal-heat sink also features a unique airflow management system, which circulates air over the entire surface of the fin for better heat dissipation. The unique design directs air progressively over its surface, ensuring that the heat is spread out evenly. The system uses four layers of fan blades, in addition to two layers of air blades, to ensure that optimal air circulation is achieved at all times. Additionally, the design allows for a minimum amount of noise from the fan to ensure a quieter and more peaceful computing environment.
The ATS-04H-97-C3-R0 is a highly effective thermal-heat sink, designed for applications such as extreme-end gaming computers, large-scale servers, and supercomputers. The thermal-heat sink allows for greater than 95% efficiency in terms of heat transfer, ensuring that any hardware running on higher-end applications remains cool and efficient. Additionally, the design of the ATS-04H-97-C3-R0 is optimized for maximum performance, allowing it to support the latest high-end graphics cards and processors.
The ATS-04H-97-C3-R0 is a great thermal-heat sink, designed to handle the toughest thermal management applications. Its unique fin design, advanced airflow management system, and its highly effective heat dissipation capabilities ensure superior performance and efficient cooling even in the most demanding of situations. Whether it’s a high-end gaming computer or a large-scale server, the ATS-04H-97-C3-R0 thermal-heat sink is the perfect solution for any thermal management application.
The specific data is subject to PDF, and the above content is for reference