| Allicdata Part #: | ATS-05A-104-C1-R1-ND |
| Manufacturer Part#: |
ATS-05A-104-C1-R1 |
| Price: | $ 4.26 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05A-104-C1-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.82851 |
| 30 +: | $ 3.61599 |
| 50 +: | $ 3.40326 |
| 100 +: | $ 3.19051 |
| 250 +: | $ 2.97781 |
| 500 +: | $ 2.76511 |
| 1000 +: | $ 2.71193 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 25.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-05A-104-C1-R1 is a thermal heat sink, designed to help dissipate heat from various components in electronic and electrical systems, such as integrated circuits, transistors, and transistors. It is designed to efficiently and uniformly dissipate the heat generated from these components, ensuring their longevity and reliability.
The two main components that make up the ATS-05A-104-C1-R1 are the heat spreader and the heat sink. The heat spreader is a thermally conductive material that is designed to transfer heat energy away from the component. The heat sink is a larger structure which is intended to absorb the transferred heat energy and dissipate it into the surrounding environment. In order for the heat sinks to achieve the desired cooling effect, it is typically designed to have a large surface area and a behavior of quickly transferring the heat away from the component.
The ATS-05A-104-C1-R1 is typically used in applications where there is a need for high-precision thermal and electrical parameters due to the components’ small thermal and electrical footprints. It is often found in the fields of circuit board and RF design, where it is used to dissipate the heat generated by components such as transistors, chips, and capacitors. In addition, the ATS-05A-104-C1-R1 can also be used for cooling systems such as notebook computers, servers, and datacenter equipment.
The ATS-05A-104-C1-R1 works by transferring the heat away from the component and dissipating it into the environment. The heat spreader is designed to reduce the temperature gradient between the component and the heat sink. The heat spreader is usually made of a material with a high thermal conductivity, such as aluminum or copper. This material ensures that the heat energy is effectively and uniformly transferred away from the component.
The heat sink then dissipates the heat into the surrounding environment. The material and design of the heat sink determines the type of cooling the ATS-05A-104-C1-R1 will be able to provide. The higher the surface area of the heat sink, the greater the cooling effect it will have. Additionally, the heat sink should be designed with a behavior of quickly transferring the heat away from the component in order to have the most effective cooling possible.
The ATS-05A-104-C1-R1 is a reliable and efficient cooling solution for conventional and high-end electronic components. Its simple design and low cost make it an attractive option for many applications. With its ability to provide effective heat dissipation, the ATS-05A-104-C1-R1 can help keep electronic components running cooler and longer, improving their overall reliability and performance.
The specific data is subject to PDF, and the above content is for reference