| Allicdata Part #: | ATS-05A-127-C3-R0-ND |
| Manufacturer Part#: |
ATS-05A-127-C3-R0 |
| Price: | $ 4.23 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-05A-127-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.80520 |
| 30 +: | $ 3.59415 |
| 50 +: | $ 3.38260 |
| 100 +: | $ 3.17123 |
| 250 +: | $ 2.95982 |
| 500 +: | $ 2.74840 |
| 1000 +: | $ 2.69555 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.91°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-Heat Sinks are an essential part of the overall thermal management system of any electronic device. The application field and working principle of ATS-05A-127-C3-R0, a type of thermal-heat sink, is described below.
Heat sinks are typically made from lightweight aluminum or copper, which offers sufficient thermal conductivity as well as strength and stability. When attached to a component that is generating heat, the thermal-heat sink absorbs heat through its surface and quickly disperses it to the surrounding air. The rate of heat dissipation is determined by the air velocity and the difference between the air temperature and the sink\'s operating temperature.
The ATS-05A-127-C3-R0 thermal-heat sink is a passive type of thermal management system. It is designed with a flat profile to reduce the air resistance, thus increasing the dissipation efficiency. The ribbed fin design of the ATS-05A-127-C3-R0 provides an extended surface area which allows for more efficient heat transfer from the device to the surrounding air. This makes it well-suited for applications where the space available to hold a heat sink is limited.
In addition, the ATS-05A-127-C3-R0 is equipped with a patented cold plate technology to further enhance the dissipation efficiency. The cold plate is composed of a heat-conductive layer and a thermally conducting one. The heat-conductive layer helps reduce the thermal resistance generated between the device and the heat sink. This ensures that heat is efficiently dissipated away from the device. The thermally conductive layer further reduces the thermal resistance between the device and the sink by creating a gap between them. By combining these features, the ATS-05A-127-C3-R0 can help reduce the overall temperature of the system by as much as 30%.
The ATS-05A-127-C3-R0 thermal-heat sink is ideal for applications that require high cooling efficiency, such as those found in gaming systems, laptops, and embedded systems. The component is certified to meet RoHS standards and boasts a lifespan of up to 5 years. Furthermore, it comes with a comprehensive warranty and a wide range of customer support services.
In conclusion, the ATS-05A-127-C3-R0 is a highly efficient thermal-heat sink suitable for use in a variety of applications. Its patented cold plate technology reduces thermal resistance and temperature, while its lightweight construction and ribbed fin design allow for improved air flow and increased heat dissipation. All of this makes the ATS-05A-127-C3-R0 an excellent choice for any thermal-management based system.
The specific data is subject to PDF, and the above content is for reference
ATS-05A-127-C3-R0 Datasheet/PDF