| Allicdata Part #: | ATS-05A-17-C3-R0-ND |
| Manufacturer Part#: |
ATS-05A-17-C3-R0 |
| Price: | $ 4.23 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05A-17-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.80520 |
| 30 +: | $ 3.59415 |
| 50 +: | $ 3.38260 |
| 100 +: | $ 3.17123 |
| 250 +: | $ 2.95982 |
| 500 +: | $ 2.74840 |
| 1000 +: | $ 2.69555 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.51°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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.Thermal - Heat Sinks: ATS-05A-17-C3-R0 Application Field and Working Principle
The thermal management of electronic components is an important part of modern electronics engineering. Heat sinks are one of the most commonly used thermal management solutions, providing an efficient way to dissipate heat away from delicate components. ATS-05A-17-C3-R0 is a type of heat sink, developed to provide exceptional cooling capabilities for highly sensitive components.
Heat sinks are typically made from a metal alloy, aluminium being the most common. The aluminium alloy used in the ATS-05A-17-C3-R0 has been specifically designed to provide maximum thermal efficiency. It is equipped with an anodised finish and treated with a specially formulated lubricant to increase its overall thermal properties. This ensures that the heat sink can effectively absorb and dissipate heat from the components it is tasked with cooling.
The main purpose of a heat sink is to spread the heat away from the component it is connected to. To do this, the heat sink needs to have an efficient surface area to dissipate the heat away from the component. The ATS-05A-17-C3-R0 heat sink has an optimized fin profile, which allows it to maximize its surface area and provide maximum heat dissipation. This ensures that the sensitive components are well protected from any excess heat.
In order to fully understand the working principle of the ATS-05A-17-C3-R0, it is important to understand how heat is dissipated from a heat sink. Heat is dissipated through thermal conduction, where heat from the component is absorbed by the heat sink and then dissipated into the surrounding air, thereby cooling the component. The ATS-05A-17-C3-R0 has an extra thick alloy which provides high thermal conductivity and ensures a rapid heat transfer from the component to the heat sink.
The ATS-05A-17-C3-R0 heat sink is designed to be highly compatible and optimized for use with a wide variety of components, including processors, FPGAs, GPUs, and RAM. It can also be used with a variety of mounting systems, making it perfect for a variety of applications. Because of its optimized efficiency, it is ideal for applications that require low-noise cooling or high-performance cooling.
The ATS-05A-17-C3-R0 is an advanced and reliable thermal solution for high performance applications. It is an ideal choice for those who require an effective and efficient way to keep their components cool and functioning optimally. Its optimized surface area and alloy construction ensures effective thermal management and long lasting performance.
The specific data is subject to PDF, and the above content is for reference