| Allicdata Part #: | ATS-05A-177-C1-R0-ND |
| Manufacturer Part#: |
ATS-05A-177-C1-R0 |
| Price: | $ 3.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05A-177-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.19788 |
| 30 +: | $ 3.11157 |
| 50 +: | $ 2.93857 |
| 100 +: | $ 2.76576 |
| 250 +: | $ 2.59291 |
| 500 +: | $ 2.50647 |
| 1000 +: | $ 2.24717 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.18°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management of electronic devices is very important, and one of the most effective methods of doing so is through the use of heat sinks. The ATS-05A-177-C1-R0 heat sink from ATS Thermal Solutions is an efficient way to dissipate heat and cool down electronic components. This guide will discuss the application field and working principle of the ATS-05A-177-C1-R0 heat sink, as well as provide installation guidelines.
The application field of the ATS-05A-177-C1-R0 is quite broad. It can be used on almost any surface in order to remove heat from sources such as CPUs, GPUs, RAM chips, and other components. The ATS-05A-177-C1-R0 is ideal for any device that requires direct contact cooling, and is particularly well-suited for the cooling of high-power electronics. Its low profile and light weight also make it a suitable choice for applications where space is limited.
The ATS-05A-177-C1-R0 heat sink works by dissipating heat from the contacted components and into the surrounding environment. The device works by using a combination of convection and conduction to transfer heat away from the source. The heat sink is composed of a combination of metal fins, which are designed to have specially angled edges in order to maximize air circulation. These fins act like individual radiators that are cooled by the surrounding environmental air.
The ATS-05A-177-C1-R0 heat sink has an industry-standard pin-fin construction, meaning that the fins are connected to the base of the unit with nuggets of metal. This helps to improve the thermal performance of the heat sink since the pins allow for maximum potential heat to be transferred from the base to the fins.
When installing an ATS-05A-177-C1-R0 heat sink, it is important to first check the fit with the contacted components. The heat sink should fit snugly around the component, and should be secured with proper mounting hardware in order to ensure proper operation. Additionally, the heat sink should be adequately prepared for thermal paste installation prior to contact with the component. This includes properly cleaning the area around the component to ensure that the thermal paste is applied evenly. Finally, the thermal paste should be applied to the base of the heat sink and the component should be placed on top.
The ATS-05A-177-C1-R0 heat sink offers superior performance in a wide variety of applications. It provides direct contact cooling in order to quickly and effectively remove heat from components, and has a small profile and light weight, making it ideal for use in densely populated areas. Additionally, its pin-fin construction allows for maximum heat transfer from the base to the fins. By following the installation guidelines, users can enjoy superior cooling performance for their electronic components.
The specific data is subject to PDF, and the above content is for reference