ATS-05A-64-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS9139-ND

Manufacturer Part#:

ATS-05A-64-C2-R0

Price: $ 4.56
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X25MM L-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-05A-64-C2-R0 datasheetATS-05A-64-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 4.13910
10 +: $ 4.02507
25 +: $ 3.80167
50 +: $ 3.57802
100 +: $ 3.35437
250 +: $ 3.13075
500 +: $ 2.90712
1000 +: $ 2.85122
Stock 1000Can Ship Immediately
$ 4.56
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.39°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

Thermal - Heat Sinks are components designed to draw and dissipate heat away from a variety of applications including electronic components, motors, and pumps. A thermal heat sink is usually composed of a base plate, usually constructed with a lightweight metal or plastic material, and a fin-like structure above the base. The thermal heat sink is attached directly to the component requiring cooling.

In order to better efficiently draw and dissipate the heat, the fin-like structure is usually made of a highly thermally conductive material such as aluminum, copper, or steel. The fins on the heat sink are intended to increase the surface area over which the heat from the component can be dissipated. The fins are spaced in such a way that as the air passes through, the thermal gap between the fins and the heat dissipating component is minimized.

The ATS-05A-64-C2-R0 is a thermal heat sink designed to dissipate heat from motors, pumps, and electronic components. It is constructed with a base made of lightweight aluminum or copper and fins made of highly thermally conductive aluminum, copper, or steel. The heat sink also features a clip to allow secure mounting of the heat sink directly to the component. This ensures that the thermal efficiency is highest and that the air is able to flow through the fins with the least resistance.

In terms of working principle, the ATS-05A-64-C2-R0 works by transferring heat away from the object and dissipating it into the ambient air. The design of the heat sink works to draw in air and pass it between the fins. The heat from the component is transferred through the base and up the fins. The air passing through the fins further dissipates the heat, allowing for maximum cooling.

The ATS-05A-64-C2-R0 thermal heat sink is designed specifically for use in applications such as motors, pumps, and electronics, and is especially suitable for applications requiring a light weight solution. The design of the ATS-05A-64-C2-R0 thermal heat sink ensures excellent thermal conductivity and efficiency.

The specific data is subject to PDF, and the above content is for reference

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