| Allicdata Part #: | ATS-05A-65-C1-R0-ND |
| Manufacturer Part#: |
ATS-05A-65-C1-R0 |
| Price: | $ 4.02 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05A-65-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.65526 |
| 30 +: | $ 3.45198 |
| 50 +: | $ 3.24904 |
| 100 +: | $ 3.04592 |
| 250 +: | $ 2.84286 |
| 500 +: | $ 2.63980 |
| 1000 +: | $ 2.58903 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.27°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-05A-65-C1-R0 is a thermal device typically used in electronic systems for the purpose of dissipating heat from circuits and other components. It is one type of heat sink that is designed to absorb and dissipate heat from the components to which it is attached. Thermal management is a critical component of an efficient thermal solution, and the ATS-05A-65-C1-R0 is a key component in this regard.
The ATS-05A-65-C1-R0 is a heat sink that consists of a metal base plate, fins and mounting hardware. The base plate is the main structural component of the ATS-05A-65-C1-R0 and is generally made of aluminum or copper. The fins are connected to the baseplate to form a framework that serves to increase the surface area of the device, allowing for more efficient heat dissipation. Finally, the mounting hardware attaches the ATS-05A-65-C1-R0 to the host component, such as a circuit board or other device.
The working principle of the ATS-05A-65-C1-R0 is based on the fact that heat naturally moves from warmer areas to cooler ones. The ATS-05A-65-C1-R0 is designed to absorb heat from the components that are attached to it and transfer it away, thus providing the needed cooling. This is done by the device\'s metal base plate, which absorbs heat, and the fins, which increase the surface area of the device and allow for greater airflow, thus speeding up the cooling process.
The ATS-05A-65-C1-R0 is a commonly used heat sink in many electronic systems. Its wide range of applications includes, but is not limited to, medical devices, industrial machines, computers, and embedded systems. Its simple design, low cost, and effective thermal management capabilities make it a popular choice for many applications.
In conclusion, the ATS-05A-65-C1-R0 is a thermal device used for dissipating heat from components. It is made up of a metal base plate, fins, and mounting hardware, and its working principle is based on the fact that heat naturally moves from warmer areas to cooler ones. The ATS-05A-65-C1-R0 is a highly effective thermal device and can be used in a variety of applications.
The specific data is subject to PDF, and the above content is for reference