ATS-05A-73-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	28.78°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction of ATS-05A-73- C1-R0 Thermal - Heat SinksATS-05A-73-C1-R0 is a type of thermal - heat sinks which is used for cooling solutions. The thermal - heat sinks are designed to dissipate heat efficiently and quickly in order to reduce temperatures within electronic components. This type of thermal - heat sinks can be used for a variety of electronic applications, ranging from automotive, industrial, telecom, medical, energy, and more. They are available in different sizes and shapes to best suit the particular application.Application Fields of ATS-05A-73- C1-R0 Thermal - Heat SinksATS-05A-73-C1-R0 thermal - heat sinks can be used for a variety of applications. One common application is in power electronics, such as voltage regulators and motor drives. These components generate significant amounts of heat, and it must be removed in order to avoid damage. Power electronics typically use large heatsinks in order to dissipate heat away from the component itself.ATS-05A-73-C1-R0 thermal - heat sinks can also be used in a variety of other electronic applications, such as automotive, industrial, telecom, medical, energy, and more. These heatsinks can typically be customized to suit the particular application, by changing the size, shape, and materials used.Working Principle of ATS-05A-73- C1-R0 Thermal - Heat SinksThe working principle of ATS-05A-73-C1-R0 thermal - heat sinks is relatively simple. Heat is transferred from the component to the heatsink, and then dissipated away from it, typically via ventilation. This is done via conduction, convection, radiation, and sometimes a combination of the three. The process of heat transfer from the component to the heatsink is known as “thermal management”.Conduction is the transfer of heat through contact. As the component and the heatsink are directly touching each other, and in many cases are soldered together, heat will transfer from the component to the heatsink.Convection is the transfer of heat through the flow of air or a fluid (such as water). This is done via ventilation, such as fans or other devices. Additionally, heat may dissipate via radiation. This is done merely by keeping the heatsink in the open, as heat radiates away from it. Finally, the efficiency of the heatsink is affected by its material properties. Aluminum is a popular material for heatsinks, as it is lightweight and has a low thermal resistance. It is also relatively cheap and easy to work with.ConclusionIn conclusion, ATS-05A-73-C1-R0 thermal - heat sinks are a type of cooling solution which is used to reduce the temperatures of electronic components. They are available in different sizes and shapes to best suit the particular application, and can be used in a variety of fields, such as automotive, industrial, telecom, medical, energy, and more. The working principle of these thermal - heat sinks is relatively simple, with heat being transferred from the component to the heatsink via conduction, convection, and radiation. The efficiency of the heatsink is also heavily dependent on its material properties.

The specific data is subject to PDF, and the above content is for reference