
Allicdata Part #: | ATS-05A-85-C1-R0-ND |
Manufacturer Part#: |
ATS-05A-85-C1-R0 |
Price: | $ 3.21 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 35X35X10MM R-TAB |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 2.92446 |
30 +: | $ 2.84550 |
50 +: | $ 2.68733 |
100 +: | $ 2.52926 |
250 +: | $ 2.37119 |
500 +: | $ 2.29216 |
1000 +: | $ 2.05503 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.378" (35.00mm) |
Width: | 1.378" (35.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.394" (10.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 23.94°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an important part of electronics design. Heat sinks help dissipate heat from delicate electronic components to keep them from overheating. The ATS-05A-85-C1-R0 is a heat sinks made of aluminum with a fin material that provides a robust thermal profile and improved performance. This thermal management solution is designed for high-power electronic components to help protect against overheating and potential damage.
Design Features
The ATS-05A-85-C1-R0 heat sink has a fin design with a 1.0 mm fin material. The fins are made of a thinner aluminum material for enhanced heat transfer, with a high-performance thermal profile. The natural surface of the aluminum fin material ensures that heat is dissipated quickly and efficiently. Additionally, the fins are designed for optimal air flow, allowing cooling air to pass freely. The ATS-05A-85-C1-R0 also features a clip-on design, making installation easy and hassle-free.
Application Field
The ATS-05A-85-C1-R0 heat sink is designed for use in high-power applications such as power converters, amplifiers, and high-end audio/visual equipment. It is also commonly used in portable battery-powered devices such as laptops and cell phones. The ATS-05A-85-C1-R0 is suitable for any device that requires higher power levels and needs more efficient cooling than other solutions.
Working Principle
The ATS-05A-85-C1-R0 heat sink works by dissipating heat generated by the electronic components. The fins of the heat sink help dissipate the heat away from the component, allowing it to cool quickly and efficiently. As the air passes through the fins, it absorbs the excess heat, carrying it away from the component and helping to maintain the component at a safe temperature. The clip-on design ensures a secure fit and easy installation onto the component.
Advantages and Limitations
The ATS-05A-85-C1-R0 heat sink has many advantages over other thermal management solutions. The clip-on design makes installation easy, while the fin material provides a robust thermal profile and improved performance. Additionally, the natural surface of the aluminum fins helps maximize air flow for cooler operation. The main limitation of the ATS-05A-85-C1-R0 heat sink is that it is designed for applications that require higher power levels and cannot be used for low-power components.
Conclusion
The ATS-05A-85-C1-R0 heat sink is a reliable and efficient thermal management solution for high-power applications. The design features a clip-on design for easy installation and thin aluminum fins for enhanced heat transfer. The aluminum fins help dissipate heat away from the component, ensuring reliable and efficient cooling. Although the ATS-05A-85-C1-R0 heat sink is designed specifically for high-power applications, it is a dependable and cost-effective solution for any application that requires more efficient cooling than other solutions.
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