| Allicdata Part #: | ATS-05B-05-C1-R0-ND |
| Manufacturer Part#: |
ATS-05B-05-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05B-05-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.69°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are widely used in electronic devices and appliances to increase their overall reliability and life span. ATS-05B-05-C1-R0 is a type of heat sink, which takes the concept of thermal management further with its unique application field and working principle.
ATS-05B-05-C1-R0 belongs to the family of boned heat sinks mostly used for pumps and cooling systems. This type of heat sinks has a simple structure, which includes a heat dissipation plate with a cylindrical fin and a central housing. The purpose of the cylindrical fin is to increase the heat dissipation of the heat sinks and the shape of the fin is optimized for low noise and effective radiation.
The thermal performance of ATS-05B-05-C1-R0 is better than the traditional finned heat sinks and is more suitable for the application of high power electronic devices. In other words, it is capable of handling greater power loads than traditional finned heat sinks. Consequently, it is able to more efficiently dissipate heat in power electronic systems.
The working principle of ATS-05B-05-C1-R0 is mainly based on air convection. This heat sink utilizes the natural convection process of air in order to achieve a greater cooling effect. When there is air circulation inside the housing, the heat is transferred from the heat dissipation plate to the cylindrical fin and eventually dissipated to the air. This ensures that the component can be cooled effectively with a lower operating temperature.
In addition, ATS-05B-05-C1-R0 is an excellent choice for outdoor applications due to its low noise levels. This makes the heat sink suitable for use in medical, military and industrial applications where component cooling is required in a silent environment.
Finally, ATS- 05B-05-C1-R0 can be easily integrated into the thermal management system of the electronic device. A wide range of accessories, such as screws, springs and rubber grommets, are available to accommodate the installation of the heat sink and improve heat dissipation.
In summary, ATS-05B-05-C1-R0 is a type of boned heat sink with a unique application field and working principle. With its effective cooling capabilities and low noise levels, it is a great choice for electronic devices and cooling systems. It is also easy to install and integrate into a thermal management system.
The specific data is subject to PDF, and the above content is for reference