ATS-05B-10-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-05B-10-C1-R0-ND

Manufacturer Part#:

ATS-05B-10-C1-R0

Price: $ 3.61
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-05B-10-C1-R0 datasheetATS-05B-10-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.28104
30 +: $ 3.19242
50 +: $ 3.01505
100 +: $ 2.83771
250 +: $ 2.66036
500 +: $ 2.57169
1000 +: $ 2.30565
Stock 1000Can Ship Immediately
$ 3.61
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.87°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Heat sinks are devices which are used to dissipate the generated heat from the system via thermal conduction or convection, and thus to prevent the possible overheating of the system. ATS-05B-10-C1-R0 is a sink device which absorbs and dissipates heat away from critical components, such as CPUs and chipsets. It is also used for other electronic and electrical heat sources such as high-power resistors and voltage regulators. This sink is a compact and highly efficient product featuring a giant heat exchange surface area and a central thermal duct.

The working principle of this thermal sink uses a combination of two methods to dissipate heat: conduction and convection. Firstly, conduction occurs when two materials of different temperature are in contact with each other; heat energy is conducted from the hotter material to the cooler material. Secondly, convection is the transfer of heat energy through liquids or gases by the process of movement of the warm material due to its lower density relative to its surrounding area. In this sink, conduction primarily occurs between the heat source and the top of the sink, while both conduction and convection occur between the heat source and the sides of the sink. Additionally, air convection allows the heat to circulate around the sink, which increases the overall heat transfer rate.

The ATS-05B-10-C1-R0 sink is made of an anodized aluminum alloy with a black thermal coating for enhanced performance. It features a finned top, which increases the total surface area and helps conduct heat away from the source efficiently. The base of the sink is lined with an adhesive thermal pad, which sticks to the heat source and makes for an effective heat transfer. The four-hotspots design helps the sink mind even temperature distribution throughout. The thermal pad also furthers this effect by efficiently directing the heat away from the heat source.

The ATS-05B-10-C1-R0 sink is most frequently used in computers, laptops, and other electronic devices, although it can be used in any application where heat must be quickly and efficiently dissipated from an electrical device. It is also used for applications such as automotive and robotics, which require high-efficiency heat sinks. Such sinks are often used to cool various processor-based products and can be customized to cater to different needs. The sink has a universal mounting system that allows for easy installation on any system.

The ATS-05B-10-C1-R0 sink is also characterized by its low power consumption, high thermal performance, and low acoustic noise. It is designed to dissipate the generated heat quickly and efficiently, so as to protect components from operating at extreme temperatures. Additionally, the design of this sink eliminates the need for additional fans, making it a great choice for energy-efficient systems.

In conclusion, the ATS-05B-10-C1-R0 sink is an excellent solution for thermal management in a wide range of applications. Its efficient heat dissipation and robust design make it a perfect choice for dissipating the generated heat in computer systems and other applications. Its low power consumption and low noise emission make it ideal for energy-conscious applications. Its easy installation, universality, and low cost make it the best for practically any use where thermal management is required.

The specific data is subject to PDF, and the above content is for reference

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