| Allicdata Part #: | ATS9196-ND |
| Manufacturer Part#: |
ATS-05B-110-C2-R1 |
| Price: | $ 5.59 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X40X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05B-110-C2-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.07780 |
| 10 +: | $ 4.93920 |
| 25 +: | $ 4.66452 |
| 50 +: | $ 4.39022 |
| 100 +: | $ 4.11585 |
| 250 +: | $ 3.84146 |
| 500 +: | $ 3.56707 |
| 1000 +: | $ 3.49848 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 26.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-05B-110-C2-R1 is a high-performance thermal heat sink designed for dissipating large amounts of heat in a wide variety of applications. This device works by absorbing thermal energy from sources like CPUs, GPUs, memory modules and other electronic components, then transferring this heat to a finned surface where it is cooled by an ambient air stream or forced convection.
This heat sink has an aluminum base and a large aluminum ribbed finned surface for increased heat dissipation. The large surface area dissipates heat efficiently, resulting in improved performance from the device. Furthermore, the fins are designed to increase the air flow from outside the unit to inside, helping cool components more efficiently. The fins also increase the surface area so more energy is dissipated and does not reach the surrounding environment.
The ATS-05B-110-C2-R1 also includes a heat pipe that serves to enhance heat transfer between the heat sink and the component being cool. The heat pipe can also be directly connected to the component, though mounting options for using the heat pipe as a direct contact to the device can vary depending on the specific application.
This thermal heat sink is suitable for cooling CPUs, GPUs, memory modules, and other components in high-performance computers, as well as for use in any application where fast and efficient cooling is required. It can also be used in a variety of industrial applications, such as electronics cooling, temperature control systems, and cooling down motors and other components in industrial machines.
The ATS-05B-110-C2-R1 is a great choice for a thermal heat sink as it is energy efficient and offers reliable and long-lasting performance. Its aluminum base and finned surface improve its cooling performance, and the heat pipe enhances heat transfer efficiency. It is easy to install and requires minimal maintenance, making it a great choice for any application requiring a dependable and efficient thermal heat sink.
The specific data is subject to PDF, and the above content is for reference