| Allicdata Part #: | ATS9199-ND |
| Manufacturer Part#: |
ATS-05B-113-C2-R0 |
| Price: | $ 3.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05B-113-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.20040 |
| 10 +: | $ 3.11472 |
| 25 +: | $ 3.03055 |
| 50 +: | $ 2.86209 |
| 100 +: | $ 2.69375 |
| 250 +: | $ 2.52542 |
| 500 +: | $ 2.44124 |
| 1000 +: | $ 2.18870 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.79°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a rapidly growing industry due to the increasing complexity and sophistication of modern electronics. Heat sinks are a key element of this technology, which are used to dissipate the heat generated by electronic products.
The ATS-05B-113-C2-R0 is a thermal management device, specifically a heat sink designed for efficient heat dissipation and thermally stable operation. This heat sink is made from aluminum and is designed to be compatible with all existing cooling technologies. The finned aluminum structure of the heat sink provides increased surface area and a greater dissipation area for thermal energy. The aluminum structure is designed to absorb heat from the environment and dissipate it away from the components.
The working principle of the ATS-05B-113-C2-R0 thermal management device is based on convection. The design of the fins ensures that the air in the immediate vicinity of the heat sink is in continuous motion, which efficiently dissipates thermal energy away from the components. The smaller, finer fins also create turbulence that further increases the rate of dissipation. This heat sink is also equipped with a base plate, which provides additional surface area that is in direct contact with the components. The base plate helps to absorb additional thermal energy and dissipate it away from the components.
The ATS-05B-113-C2-R0 thermal management device is capable of dissipating significant amounts of heat from electronic components. It has been specifically designed for use in high performance computers and other applications that require a reliable and efficient cooling solution. The design of the heat sink ensures that the components are kept cool and thermally stable even under extreme conditions such as high temperatures, extreme power usage, or long run times. The ATS-05B-113-C2-R0 can also be used in portable electronics and other small electronic devices, as it is both small and lightweight.
In conclusion, the ATS-05B-113-C2-R0 thermal management device is an excellent solution for managing the thermal energy of electronic components. Its efficient design ensures that heat is dissipated away from the components quickly and efficiently. The aluminum structure provides increased surface area for greater dissipation. The base plate helps to absorb additional thermal energy. This heat sink is a reliable and efficient cooling solution for high performance computers and a variety of other applications.
The specific data is subject to PDF, and the above content is for reference