| Allicdata Part #: | ATS9222-ND |
| Manufacturer Part#: |
ATS-05B-134-C2-R0 |
| Price: | $ 7.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X15MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05B-134-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 6.58350 |
| 10 +: | $ 6.40773 |
| 25 +: | $ 6.05203 |
| 50 +: | $ 5.69596 |
| 100 +: | $ 5.34001 |
| 250 +: | $ 4.98401 |
| 500 +: | $ 4.62801 |
| 1000 +: | $ 4.53900 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are an important element in the efficient safe operation of many electrical and electronic components. The ATS-05B-134-C2-R0 Heat Sink is a type of Aluminum Heat Sink commonly used in the industry. It is designed as a low-cost solution for efficient and dependable heat transfer.
The advanced technology used to construct the ATS-05B-134-C2-R0 Heat Sink is what makes it ideal for many applications. For example, the ATS-05B-134-C2-R0 Heat Sink has a durable, lightweight aluminum body that can be safely installed in tight spaces. It has an anodized finish for even better heat transfer. This allows it to provide a greater thermal management solution in industry applications.
The ATS-05B-134-C2-R0 Heat Sink is an extruded aluminum device. The extrusion process makes it a cost effective solution compared to other methods used in the industry. Using extrusion, the heat sink is designed with grooves along its fins which greatly increase the surface area of the device for greater thermal transfer capabilities. This also ensures that it is much more cost effective compared to other traditional heat sink designs. The fins also contain an additional fin that acts as a mounting point for additional aluminum heat sinks.
The ATS-05B-134-C2-R0 Heat Sink is widely used in commercial and industrial applications. The heat sink is often utilized in the cooling of electronics, computers, and even domestic electrical components. In all of these environments, the ATS-05B-134-C2-R0 is able to provide a reliable and efficient way of dissipating the heat generated from the components it is cooling.
The ATS-05B-134-C2-R0 Heat Sink is designed to work in a number of different environments. It is capable of working in either air or liquid cooled environments. Air cooled environments require a low profile heat sink to reduce the amount of air that passes over the heat sink. This is done by using a larger fin in the body of the heat sink. In liquid cooled environments, the heat sink is designed with a larger fin to conduct the heat away from the surface of the liquid. This ensures efficient and effective heat transfer away from the surface of the component being cooled.
The ATS-05B-134-C2-R0 Heat Sink is also designed to allow airflow through the bottom and out of the top of the heat sink. Airflow through the heat sink and around the component being cooled is necessary to maximize the thermal transfer away from the component. The air is also able to carry away the heat and dust that is drawn away from the components being cooled.
The ATS-05B-134-C2-R0 Heat Sink is a very versatile and effective thermal management solution for the industry. The device is incredibly durable, which makes it ideal for a wide range of applications. With its ability to work in both air and liquid cooled environments, it is a cost-effective and reliable thermal management solution for the electronics industry.
The specific data is subject to PDF, and the above content is for reference