ATS-05B-136-C1-R0

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Thermal management is a critical component of electronic equipment, and one of the key pieces of technology used in most modern electronics is the heat sink. A heat sink is an inexpensive thermal interface material (TIM) designed to dissipate excess heat away from heat-generating components. The ATS-05B-136-C1-R0 is a high-performance heat sink that is widely used in a variety of applications. In this article, we will take a look at the application field and working principle of the ATS-05B-136-C1-R0.

The ATS-05B-136-C1-R0 is a thermally optimized, cost-effective heatsink specifically designed for applications with reduced voltage and power density. It is typically used in applications where high levels of power and temperature control are required, such as servers, storage and networking equipment. The ATS-05B-136-C1-R0 also has been used in a variety of consumer electronics, including laptops, game consoles, and wearable devices.

The ATS-05B-136-C1-R0 is made of aluminum with extruded fins. It is designed to provide an inexpensive thermal platform with high thermal performance, high voltage capability, and resistance to corrosion. The aluminum fins facilitate the maximum amount of heat dissipation from the source components, while also providing high levels of rigidity and durability. The heat sink is sufficiently large to accommodate components of any size, ranging from small chips to large processors. It also has a low profile to accommodate space constraints.

The ATS-05B-136-C1-R0 works by using the unique combination of thermally conductive aluminum fins and a high-grade thermal interface material (TIM). The TIMs used are typically a combination of natural products such as clay, rubber, and paper pulp. The TIM ensures the maximum amount of heat is transferred away from the heat source component and into the fins, where it is then dissipated into the surrounding air. The fins also act as a heat spreader, spreading the heat towards the outside environment in a uniform manner.

The ATS-05B-136-C1-R0 is designed to be easy to install. The entire heat sink is contained in an easy-to-handle package, with no additional assembly required. The heat sink can be mounted directly onto the component or board and is designed to be compatible with any standard board layout. The package also includes silicone-based screws for mounting, making installation quick and easy.

The combination of performance, cost-effectiveness, and ease of installation makes the ATS-05B-136-C1-R0 one of the most popular thermal management solutions for electronic equipment. It is often the first choice for applications that require high-performance, reliable heat dissipation, and low-cost installation. The ATS-05B-136-C1-R0 is an ideal solution for manufacturers and designers who need a reliable thermal platform that can accommodate any size components.

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