ATS-05B-16-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	18.08°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are components designed to efficiently dissipate heat from their surfaces. Heat sinks are used in a variety of applications, including cooling electronics, controlling temperatures in high-end machines, and conducting thermal experiments. In this article, we will discuss the specific application and working principle of the ATS-05B-16-C2-R0 Heat Sink.

Application

The ATS-05B-16-C2-R0 Heat Sink is designed to provide efficient cooling for high-powered electronic components, such as MCUs, GPUs, and processors. The heat sink is particularly suited for systems that experience extreme thermal conditions, such as those used in high-performance gaming PCs. It works in tandem with other cooling components, such as fans and liquid coolers, to provide maximum performance.The heat sink is also used in other applications, including controlling temperatures in medical devices, providing thermal protection in industrial environments, and conducting experimental processes in scientific laboratories. The high-powered nature of the device makes it suitable for use in a wide variety of applications.

Design

The ATS-05B-16-C2-R0 Heat Sink is designed to offer maximum heat dissipation, while also providing optimal airflow. The heat sink is constructed from a combination of extruded aluminum and copper, with a total height of 16 cm and a width of 14 cm. The base of the heat sink is covered with a 0.5 mm nickel-plated layer, which helps to ensure that the surface remains flat.The ATS-05B-16-C2-R0 Heat Sink is designed with multiple fins, which are designed to increase surface area and facilitate heat dissipation. The fin pattern is also designed to maximize airflow and promote uniform cooling. The fins are also highly conductive, which helps to ensure that the heat sink is able to dissipate heat quickly and efficiently.

Working Principle

The working principle of the ATS-05B-16-C2-R0 Heat Sink is fairly straightforward. The heat sink works by absorbing heat from the surface of the component it is attached to. This heat is then transferred to the fins, which dissipate the heat through convection.The heat sink is designed to maximize convection, by creating an air pocket between the surface of the heat sink and the component it is attached to. This ensures that the air is able to circulate freely around the component, allowing the heat to be efficiently dispersed.

Conclusion

The ATS-05B-16-C2-R0 Heat Sink is a versatile cooling component, which is suitable for use in a variety of applications. The heat sink is designed to provide efficient cooling for high-powered components, while also allowing for maximum airflow and uniform cooling. The heat sink works using the simple concept of convection, which ensures that heat is quickly and efficiently dissipated.

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