| Allicdata Part #: | ATS9271-ND |
| Manufacturer Part#: |
ATS-05B-179-C2-R0 |
| Price: | $ 4.28 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05B-179-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.88710 |
| 10 +: | $ 3.78252 |
| 25 +: | $ 3.57210 |
| 50 +: | $ 3.36206 |
| 100 +: | $ 3.15195 |
| 250 +: | $ 2.94182 |
| 500 +: | $ 2.73169 |
| 1000 +: | $ 2.67917 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are needed to regulate over-heating issues in a variety of industries and technologies. In some cases, a heat sink is a suitable operational solution. Heat sinks are used to help reduce and absorb heat from electrical and electronic components. ATS-05B-179-C2-R0 is a heat sink that can be used to address heat management needs in various applications.
The ATS-05B-179-C2-R0 is an aluminum single-fin heatsink composed of a base plate, integral fins, and a rib design. The alloy\'s thermal properties make it ideal for use in higher wattage and thermal management applications. It is designed for applications with working temperatures up to 250°F. The base plate of the finned heat sink is bonded to an extruded aluminum tube, creating a high-performance heat sink and reducing thermal resistance. The corner of each fin has an integral rib which allows for tighter fin spacing, resulting in higher heat exchange efficiency.
The heat transfer of a finned heat sink can be affected by the air quality. The ATS-05B-179-C2-R0 is designed to minimize air flow restrictions and to maximize thermal transfer. The base plate and fins of the heat sink are integrally formed, creating a single aluminum assembly with a uniform thermal resistance. The fins are also tightly spaced for increased performance and are designed in a way that allows for forced-air or natural convection cooling.
The most common application of the ATS-05B-179-C2-R0 is in the dissipation of the heat generated by electrical and electronic components. It can also be used to regulate temperature in a variety of other applications, from medical imaging to power delivery systems. In these applications, the heat sink can be used to absorb and disperse the heat produced by a component, thereby eliminating any risk of damage due to overheating.
The working principle of the ATS-05B-179-C2-R0 is based on a thermodynamic concept known as conduction. This means that heat flows from a hotter object to a cooler object. In this case, the heat generated by an electrical or electronic component is absorbed by the heat sink and then dissipated into the surrounding environment. The fins of the heat sink act as large area radiators, allowing heat to be quickly transferred from an area of higher temperature to a lower temperature.
The ATS-05B-179-C2-R0 heat sink is a reliable and cost-effective solution for thermal management applications. Its design and construction make it an ideal choice for a wide range of applications where temperature control is necessary, including medical imaging, power delivery systems, and electronics. As with any component, installation should be done properly and regularly maintained to ensure optimal performance and longevity.
The specific data is subject to PDF, and the above content is for reference