| Allicdata Part #: | ATS-05B-37-C1-R0-ND |
| Manufacturer Part#: |
ATS-05B-37-C1-R0 |
| Price: | $ 5.43 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X17.78MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05B-37-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.88124 |
| 30 +: | $ 4.60992 |
| 50 +: | $ 4.33881 |
| 100 +: | $ 4.06766 |
| 250 +: | $ 3.79648 |
| 500 +: | $ 3.52531 |
| 1000 +: | $ 3.45751 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.10°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal Heat Sinks are a critical component in many areas of manufacturing and electronics. The ATS-05B-37-C1-R0 thermal heat sink is a highly efficient device designed for a wide range of applications. In this article, we will explore the features and benefits of the ATS-05B-37-C1-R0, as well as its application field and working principle.
The ATS-05B-37-C1-R0 is a heat sink designed to dissipate large amounts of heat from electronic components. It is made from copper, aluminum and plastic, and is designed to provide exceptional cooling performance and reliability. The aluminum fins provide a large surface area for heat to dissipate, while the copper core ensures the heat transfer is stable and consistent. The plastic frame further increases the reliability of the device and provides additional protection from physical damage.
One of the main benefits of the ATS-05B-37-C1-R0 is its wide range of applications. It can be used in a variety of electronic applications, including industrial equipment, computers, servers, telecommunications equipment, and more. The device is also well suited for applications that require high frequency cooling, such as high-speed processors and high-performance memory modules. It is also an ideal choice for applications where space is limited, such as small form factor PCs.
The soft construction of the ATS-05B-37-C1-R0 makes it suitable for thermal coupling, allowing for greater efficiency in cooling. The device has a small footprint and is designed to provide maximum cooling performance in confined spaces. The wide range of mounting options available for the ATS-05B-37-C1-R0 make it easy to install the device in a variety of applications.
The working principle of the ATS-05B-37-C1-R0 is simple yet effective. The device works by transferring heat from the electronic component into the air around it. The aluminum fins provide a large surface area for the heat to escape, and the copper core helps to ensure that the heat transfer is stable and consistent. The device is also equipped with a fan-less design, ensuring quiet operation while still providing maximum cooling performance.
The ATS-05B-37-C1-R0 is a highly efficient thermal heat sink, designed for a wide range of applications. Its soft construction makes it easy to mount in confined spaces, and its wide range of mounting options make it easy to install in a variety of applications. The device is well suited for applications that require high-frequency cooling, and its fan-less design ensures quiet operation while still providing maximum cooling performance. Finally, its working principle is simple yet effective, providing reliable and consistent cooling performance.
The specific data is subject to PDF, and the above content is for reference