ATS-05B-48-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-05B-48-C1-R0-ND

Manufacturer Part#:

ATS-05B-48-C1-R0

Price: $ 3.70
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X35MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-05B-48-C1-R0 datasheetATS-05B-48-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.36420
30 +: $ 3.27348
50 +: $ 3.09154
100 +: $ 2.90972
250 +: $ 2.72785
500 +: $ 2.63691
1000 +: $ 2.36412
Stock 1000Can Ship Immediately
$ 3.7
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.44°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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ATS-05B-48-C1-R0 Thermal - Heat Sinks

The ATS-05B-48-C1-R0 thermal-heat sinks are used to conduct and dissipate heat from high power electrical components. Heat sinks promote the flow of heat away from hot components and into the surrounding air. By cooling an electronic component or assembly the life and reliability of the device can be significantly increased. These heat sinks are available in a variety of sizes and shapes to accommodate both high and low power components, making them suitable for a wide range of applications.

Application Field

The ATS-05B-48-C1-R0 thermal-heat sinks are mainly used for cooling components in computers, communications equipment, industrial equipment, and other electronic products. These heat sinks are most commonly used in power transistors, integrated circuits, and other components with a high power density. The ATS-05B-48-C1-R0 is also widely used in automotive, aerospace, and military applications.

Working Principle

The ATS-05B-48-C1-R0 thermal-heat sinks use a combination of conduction and convection to ensure effective cooling. Heat is first dissipated from the device being cooled via conduction to the heat sink\'s metal base. This heat sink base is designed with a large surface area which is exposed to the surrounding air in order to facilitate convection. As the air surrounding the heat sink warms up, it rises, pulling cool air in the gap between the heat sink and the device. This process continues as more and more warm air is drawn in and pulled away from the cooling component, allowing it to maintain its temperature at a safe level.

The ATS-05B-48-C1-R0 thermal-heat sinks are designed to function even in high temperature, high vibration environments. The heat sinks also feature advanced thermal performance, excellent thermal shock resistance, a high tolerance for thermal cycling, and a high resistance to oxidation. This makes the ATS-05B-48-C1-R0 heat sinks ideal for a variety of applications and ensures reliable operation.

The ATS-05B-48-C1-R0 thermal-heat sinks are an ideal choice for applications that require effective cooling and reliable performance in extreme environments. The advanced design and construction of these heat sinks ensure that they will provide superior heat dissipation and reliable operation for years to come.

The specific data is subject to PDF, and the above content is for reference

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