| Allicdata Part #: | ATS9321-ND |
| Manufacturer Part#: |
ATS-05B-48-C2-R0 |
| Price: | $ 3.95 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X35MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05B-48-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.59100 |
| 10 +: | $ 3.49335 |
| 25 +: | $ 3.29918 |
| 50 +: | $ 3.10502 |
| 100 +: | $ 2.91098 |
| 250 +: | $ 2.71691 |
| 500 +: | $ 2.52285 |
| 1000 +: | $ 2.47433 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.51°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become increasingly important as electronic devices grow smaller, lighter, and faster. ATS-05B-48-C2-R0, an advanced thermal heat sink, is a specialty component used to maximize the performance of electronic systems while maintaining a low thermal footprint. It is a highly effective thermal management tool for mission critical applications.
The ATS-05B-48-C2-R0 thermal heat sink is designed to dissipate heat from critical electronic components, such as microprocessors and other integrated circuits, which can generate large amounts of heat during operation. The device functions by attracting heat from its surface, which is typically adjacent to an electronic component, and transferring it away from the component to an area of lower temperature. The ATS-05B-48-C2-R0 achieves thermal control by diffusing heat from the component to the air or by transferring it to a cooling medium.
The design of the ATS-05B-48-C2-R0 thermal heat sink is based upon the principles of convective and thermal conduction. Convection is the process by which heated air is circulated through the fins of the heat sink, allowing the heat to escape from the environment more easily. Thermal conduction, on the other hand, is the transfer of heat through physical contact between the component and the heat sink. This is accomplished through the use of thermally conductive materials, such as copper or aluminum, which ensure that heat is evenly and effectively distributed.
The ATS-05B-48-C2-R0 thermal heat sink is ideal for use in applications where reliability, performance, and thermal management are paramount. The heat sink is robust and offers a high level of thermal transfer, so it is ideal for demanding applications that require maximum cooling efficiency with minimal size and weight. Additionally, the ATS-05B-48-C2-R0 utilizes a patented design that ensures proper heat dissipation while minimizing negative impacts on the environment.
In summary, the ATS-05B-48-C2-R0 thermal heat sink is a sophisticated thermal management tool that offers superior cooling performance in a compact, lightweight package. The device is designed to efficiently and quickly dissipate heat from critical electronic components while maintaining a low thermal footprint. As such, it is an excellent choice for applications that require superior thermal management solutions.
The specific data is subject to PDF, and the above content is for reference