ATS-05B-64-C3-R0

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Thermal management solutions have become increasingly critical as electronics become more compact, powerful, and therefore more difficult to cool. ATS-05B-64C-3-R0 is a new form of Thermal - Heat Sink, introduced by Advanced Thermal Solutions Inc. (ATS) to further improve the thermal performance of power electronics applications.

The ATS-05B-64C-3-R0 solution is designed to be used in applications where a high level of a thermal energy is dissipated. It features a three-stage heat sink stack with a copper baseplate and a combination of Cooper and Aluminum fins, along with the latest in technology for efficient heat transfer. Copper can be used to provide higher thermal displacement, while also being lightweight. Its thermal conductivity is four times that of aluminum and is appreciated in cases of higher power cooling. This type of combination of materials is essential to provide good heat dissipation across a range of thermal ratings.

When used in applications, the 3 stage stack can be configured for various thermal performances, with high thermal coupling due to its contact area. It features an adjustable horizontal mounting system that enables height and depth changes of the stack. This allows the customer to customize the design for a range of applications. Further, the aluminum fins increase the surface area for cooling, helping to maximize the effectiveness of the heat dissipation.

In addition, ATS-05B-64C-3-R0 features active cooling options to manage the system temperature. This active cooling is achieved using fans with specific impeller designs and voltage requirements. The ATS-05B-64C-3-R0 also supports variable fan speeds, allowing the user to tailor the fan speed to the application needs. The fan is further designed to be low noise and runs within a 35dBA range.

The ATS-05B-64C-3-R0 is small and lightweight, making it an ideal solution for embedded electronics, server racks, and other equipment requiring cooling solutions in confined areas. Its design allows it to be easily integrated into existing systems and offers a cost-effective solution for system cooling.

The working principle of the ATS-05B-64C-3-R0 is based on convection. The thermal energy is dissipated through the fins of the heat sink stack, which create an airflow over the surface. The airflow draws in air from both sides of the stack, which cools the system and ensures efficient heat exchange. The thermal energy travels through the baseplate and is transferred to the surrounding environment, where it is dissipated.

In conclusion, ATS-05B-64C-3-R0 is a reliable and cost-effective solution for applications where a high level of thermal energy needs to be dissipated. It is designed to provide a good thermal coupling and to be an easy to install and highly customizable solution. Its combination of copper baseplate and aluminum fins helps to provide efficient heat transfer, quickly dissipating the heat energy and allowing the system to remain at optimal temperatures.

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