| Allicdata Part #: | ATS-05B-76-C3-R0-ND |
| Manufacturer Part#: |
ATS-05B-76-C3-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05B-76-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.18591 |
| 30 +: | $ 3.09981 |
| 50 +: | $ 2.92774 |
| 100 +: | $ 2.75549 |
| 250 +: | $ 2.58325 |
| 500 +: | $ 2.49714 |
| 1000 +: | $ 2.23882 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-05B-76-C3-R0 can be classified as a thermal - heat sinks device, and its application field and working principle are as follows:
Application Field
ATS-05B-76-C3-R0 is typically used in electronic and thermal applications. It has a wide application range for industrial, military, medical, commercial and consumer electronics, as well as aerospace applications. The ATS-05B-76-C3-R0 thermal - heat sinks device can be used for a variety of tasks, including:
- Cooling down high-powered processors
- Controlling power consumption of many electronics
- Controlling heat dissipation from various components
- Providing a heat stress relief from thermal cycling conditions
- Protection from electrical short circuits
- Heat dissipation in environments with elevated temperatures
- Eliminating hot spots in areas of high temperature flux
These are just some of the areas of application the ATS-05B-76-C3-R0 can be used in. Its sleek design makes it an ideal choice for designers who need to fit the device into tight spaces.
Working Principle
The ATS-05B-76-C3-R0 is built using an advanced heat sink design which enables it to effectively dissipate heat away from the target components. It works by transferring the heat generated by the components in a system away from the source, which effectively keeps the temperature of the target area within its specified thermal range.
A series of fins are used to increase the surface area of the device, which in turn increases its ability to dissipate the heat away from the source more effectively. The fins also act as a barrier to air circulation, creating a pressure difference between the front and back of the device, which increases its overall efficiency. An additional layer of insulation is used to further reduce heat transfer to the environment, while a series of vents allow the device to release the heated air at a controlled rate. This ensures that the temperature of the components remain within the specified ranges at all times.
The ATS-05B-76-C3-R0 by no means relies exclusively on air cooling to carry out its tasks; it is also designed to take advantage of other forms of cooling technology. By utilizing copper, aluminum or graphite as a substrate, the device can absorb additional heat from the components to further reduce their temperatures. This makes it much more efficient than simply relying on air cooling alone.
Overall, the ATS-05B-76-C3-R0 thermal - heat sinks device has proven itself to be an effective and reliable tool in providing thermal and power control for a wide variety of applications. Its versatility makes it an ideal choice for engineers who need to utilize bulk and space-saving designs for their projects.
The specific data is subject to PDF, and the above content is for reference