| Allicdata Part #: | ATS-05B-85-C3-R0-ND |
| Manufacturer Part#: |
ATS-05B-85-C3-R0 |
| Price: | $ 3.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05B-85-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.31695 |
| 30 +: | $ 3.22707 |
| 50 +: | $ 3.04781 |
| 100 +: | $ 2.86858 |
| 250 +: | $ 2.68930 |
| 500 +: | $ 2.59965 |
| 1000 +: | $ 2.33071 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 24.11°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices that absorb heat in order to keep systems cool and functioning. ATS-05B-85-C3-R0 is a high-performance heat sink designed for embedded applications. It combines many advanced features such as low profile, high heat-dissipation capacity, superior thermal conductivity, and superior electrical insulation. The ATS-05B-85-C3-R0 is an ideal choice for applications that require high performance and excellent cooling performance.
The ATS-05B-85-C3-R0 is primarily designed for high power embedded applications. It is constructed from aluminum and is available in multiple sizes and configurations to meet different application needs. It offers excellent thermal conductivity which helps transfer heat away from the components to the ambient environment quickly and efficiently. The aluminum construction also provides superior electrical insulation protecting delicate electronic components from damage due to electrostatic discharge.
The ATS-05B-85-C3-R0 is designed with adjustable fins to ensure maximum heat dissipation. The fins are designed to increase the exposed surface area of the heat sink, this in turn increases the amount of heat it can absorb from the surrounding environment. The alignment of the fins also help to improve the cooling performance by decreasing air resistance and allowing air to flow through the heat sink more efficiently. This helps to keep the components within the heat sink cool and functioning properly.
In addition to its excellent cooling performance, the ATS-05B-85-C3-R0 also offers excellent protection from electromagnetic interference. This is achieved by its superior electrical insulation which helps to prevent interference from other electrical components from affecting the performance of the heat sink. It also features a low profile design which allows the device to be mounted easily in tight spaces.
Overall, the ATS-05B-85-C3-R0 is a highly efficient and reliable thermal solution for high power embedded applications. It offers excellent thermal conductivity and superior electrical insulation that help to maintain efficient cooling performance and reliable operation. Its low profile design and adjustable fins further enhance its performance and make it an ideal choice for tight spaces. With its advanced features, the ATS-05B-85-C3-R0 is an excellent choice for heat dissipation in high power embedded applications.
The specific data is subject to PDF, and the above content is for reference