| Allicdata Part #: | ATS-05B-90-C1-R0-ND |
| Manufacturer Part#: |
ATS-05B-90-C1-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05B-90-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.58596 |
| 30 +: | $ 3.38646 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-05B-90-C1-R0 is a specialized thermal - heat sink device used to efficiently dissipate heat away from sensitive electronic components. Heat sinks are an important component of any computing or electronics system - dissipating heat efficiently helps reduce energy consumption and prolong life of components, and they are also used as part of the cooling systems in larger devices such as laptops and servers. The ATS-05B-90-C1-R0 is a high-efficiency heat sink designed for use in high-performance computing applications.
The ATS-05B-90-C1-R0 is made from a high-grade aluminum alloy, which is designed to be resistant to corrosion, and has a low thermal conductivity rating. It also features a dual-surfaces design, which allows for an efficient heat dissipation from both sides of the heat sink. This combination of features allows the ATS-05B-90-C1-R0 to effectively dissipate heat away from sensitive components, while also reducing the risk of overheating and thermal damage.
The ATS-05B-90-C1-R0 working principle is based on passive heat transfer. Heat is conducted from the heat source (usually a processor) through the base plate of the heat sink, and then up through the body of the ATS-05B-90-C1-R0. The heat is further transferred and dissipated through the fins in the heat sink, which are exposed to the ambient air. This allows for an efficient and reliable transfer of heat away from sensitive components inside the system.
The ATS-05B-90-C1-R0 is is designed for high-performance computing applications requiring efficient cooling solutions. It is ideal for workstations, gaming systems, and high-end servers where cooling needs are more demanding. The device also features a low-cost and low-profile design, making it suitable for compact and space-constrained environments. The heat sink can also be installed with ease thanks to the included mounting hardware.
The ATS-05B-90-C1-R0 is an ideal thermal - heat sink device for efficiently dissipating heat away from sensitive electronic components. This heat sink device is designed with a low-cost and low-profile design for compact and space-constrained environments. It features a dual-surfaces design, which enables it to transfer heat efficiently from both sides of the heat sink, while also reducing the risk of overheating and thermal damage. The device is designed for high-performance computing applications where efficient cooling is essential, and can be installed with ease thanks to the included mounting hardware.
The specific data is subject to PDF, and the above content is for reference