ATS-05B-97-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	20.30°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-05B-97-C2-R0 thermal - heat sink is a heat dissipation device designed to transfer thermal energy away from a component or system and dissipate it to the atmosphere. They are commonly used with high-power components such as processors, power rectifiers, and other components that generate a significant amount of heat during operation. This type of heat sink works by slowly pulling heat away from the component, allowing it to dissipate into the atmosphere.

Design Features

The ATS-05B-97-C2-R0 thermal heat sink is designed to be both light weight and energy efficient. It is constructed using a combination of aluminum and copper to provide greater thermal conductivity. The aluminum is used for the base of the sink, while the copper is used for the fins. The fins are ridged and designed to draw heat away from the component and dissipate it into the atmosphere.

Operation and Application

The ATS-05B-97-C2-R0 thermal heat sink works by dissipating the heat generated by the component or system. Heat is transferred from the component to the thermal heat sink where it is directed through the ridged fins. As air passes over the ridged fins, the heat is dissipated into the atmosphere.The thermal heat sink is typically used with high-power components in a variety of applications. These include computers, video game systems, laboratory instruments, industrial machinery, and other areas where high-power components generate excessive heat. The thermal heat sink helps keep the component running at optimal temperature, ensuring efficient operation and reducing the risk of component failure.

Conclusion

The ATS-05B-97-C2-R0 thermal heat sink is an efficient and effective way to dissipate the heat generated by high-power components and systems. Its combination of aluminum and copper construction provides greater thermal conductivity, allowing the sink to dissipate the heat quickly and efficiently. It is commonly used in computers, video game systems, laboratory equipment, and other areas where high-power components generate excessive heat. By properly using a thermal heat sink, component operation can be kept at optimal temperatures, ensuring efficient operation and reducing the risk of component failure.

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