| Allicdata Part #: | ATS-05C-07-C1-R0-ND |
| Manufacturer Part#: |
ATS-05C-07-C1-R0 |
| Price: | $ 3.31 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05C-07-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.00762 |
| 30 +: | $ 2.92635 |
| 50 +: | $ 2.76381 |
| 100 +: | $ 2.60127 |
| 250 +: | $ 2.43868 |
| 500 +: | $ 2.35738 |
| 1000 +: | $ 2.11351 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 16.97°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential for efficient operation of electronic components in high performance applications. ATS-05C-07-C1-R0 is a thermal heat sink developed for this purpose. It is mainly used in high power applications where heat dissipation is required in order to reduce operating temperature and protect the components.
The ATS-05C-07-C1-R0 consists of an aluminum base plate and an aluminum finned heat sink. The base plate is designed to be mounted onto the device or board. The fins act as “dissipating finned surfaces” which increases the heat dissipation efficiency. The finned area is increased by up to four times compared to a reference thermal solution without a finned heat sink. This increases the thermal performance ability significantly.
The working principle of ATS-05C-07-C1-R0 is based on the principles of natural convection. The air inside the fins is heated by the device or board, and rises up through the channels between the fins. As the air becomes less dense, the heated air rises. At the same time, the cooler air from the surrounding environment enters the sink and is drawn through the path of least resistance. This cool air then passes through the sink and takes the heat away from the device or board. The hot air rises at the front of the sink, while the cooler air is drawn in from the back of the sink. This repeating cycle allows for the maximum cooling efficiency to be achieved.
The main utilization of ATS-05C-07-C1-R0 is for cooling systems that require high thermal management efficiency. This type of heat sink is particularly suitable for mounting on boards that generate large amounts of heat and require efficient cooling. These boards can range from high power CPUs and GPUs to servers, game consoles, and computers. This heat sink is also suitable for automotice applications.
In summary, ATS-05C-07-C1-R0 is a thermal heat sink that uses natural convection to dissipate heat from electronic components. It is mainly used in high power applications such as CPUs, GPUs, servers, game consoles, and computers. This heat sink is designed to provide maximum thermal management efficiency and is suitable for automotive applications.
The specific data is subject to PDF, and the above content is for reference