| Allicdata Part #: | ATS9379-ND |
| Manufacturer Part#: |
ATS-05C-07-C2-R0 |
| Price: | $ 3.88 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05C-07-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.52800 |
| 10 +: | $ 3.43539 |
| 25 +: | $ 3.24450 |
| 50 +: | $ 3.05361 |
| 100 +: | $ 2.86278 |
| 250 +: | $ 2.67193 |
| 500 +: | $ 2.48108 |
| 1000 +: | $ 2.43337 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 17.00°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are designed to reduce the temperature of objects like computer chips. Heat sinks are commonly made of metal, such as copper or aluminum. They are then connected to a thermal interface material (TIM), such as thermal pads or grease. The TIM then transfers the heat from the object to the heat sink. Heat sinks also rely on convection and conduction, where the heat from the object is transferred by air or from metal parts.
ATS-05C-07-C2-R0 is a heat sink that is designed for applications with higher thermal demands. This heat sink is manufactured from copper, which has a high thermal conductivity. This ensures that heat can be transferred more efficiently and that the temperature of the object being cooled is lowered quickly and effectively. The heat sink also has a flat base that ensures optimal contact between the object and the heat sink.
The working principle of a heat sink is to transfer heat from objects with high thermal demands to the cooler surrounding environment. Heat sinks are designed to provide a large surface area for the thermal interface material to transfer heat to the heat sink. As the heat is transferred, the temperature of the object decreases to prevent overheating.
The ATS-05C-07-C2-R0 heat sink is designed for applications with a high thermal load, such as power electronics. The thermal pad or grease that is used with this heat sink ensures that the heat is transferred more effectively and quickly. This ensures that the temperature of the object being cooled is kept at an optimal level for efficient and safe operation.
The ATS-05C-07-C2-R0 heat sink also features an advanced design that ensures that it dissipates the maximum amount of heat from the object and that the heat is distributed evenly across the surface area. This ensures that there is no hot spot in the heat sink which could cause an increase in temperature. This is especially important in applications that require precise temperature control.
In conclusion, the ATS-05C-07-C2-R0 heat sink is designed for applications that require high thermal performance and precise temperature control. It uses a copper base and thermal pad or grease to ensure optimal heat transfer, and its advanced design ensures that heat is distributed evenly across its surface area. This ensures that the object being cooled is kept at an optimal temperature for efficient and safe operation.
The specific data is subject to PDF, and the above content is for reference