ATS-05C-10-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.99°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Application Field and Working Principle of ATS-05C-10-C3-R0 Heat Sink

Heat sink is a device used to dissipate heat from one object to another by conducting heat away from a hot object, such as an electronic circuit or motor. Heat sinks relies greatly on the principles of thermodynamics, convection, conduction and radiation to dissipate heat. ATS-05C-10-C3-R0 is a heat sink designed to effectively dissipate heat generated by electronic components housed within a system.

Applications of ATS-05C-10-C3-R0 Heat Sink

The ATS-05C-10-C3-R0 Heat Sink is used for a wide array of applications, such as cooling CPUs and graphics processors in PCs, preventing overheating of components in surveillance systems, and preventing overheating of electronic components in automobiles. It is also used in a variety of professional and consumer electronics, including high-performance media servers and gaming consoles.

Principle of ATS-05C-10-C3-R0 Heat Sink

Heat sinks operate based on the principles of thermodynamics, convection, conduction, and radiation. The most commonly used heat sinks are aircooled, liquid cooled, and passive cooled systems.The ATS-05C-10-C3-R0 Heat Sink utilizes an aluminum fin heat sink with a base constructed out of copper. The fins are designed to dissipate the heat produced by electronic components, and the copper base helps to quickly draw away the heat generated. The heat sink comes with a fan and a fan guard to ensure sufficient airflow over the fins for maximum cooling efficiency.The ATS-05C-10-C3-R0 Heat Sink utilises passive cooling, radiation, and convection. Radiation helps to dissipate heat produced by electronic components. This is achieved by radiating heat away from the component. Convection occurs when warm air rises and cool air is drawn in, resulting in a convective airflow. This natural airflow circulates over the fins of the heat sink, aiding in the dissipation of heat. Finally, passive cooling occurs when the fins of the heat sink absorb heat and disperse it to the surrounding environment.

Advantages of ATS-05C-10-C3-R0 Heat Sink

The ATS-05C-10-C3-R0 Heat Sink has several advantages over other types of cooling systems. The primary advantage is the efficient heat dissipation provided by the fin design, as well as its ability to quickly draw away the heat generated. This makes the ATS-05C-10-C3-R0 ideal for applications where high performance and reliability are important. The fan guard also provides protection against any objects that may come into contact with the fan blades.Additionally, the ATS-05C-10-C3-R0 Heat Sink is very durable and requires minimal maintenance. This makes it ideal for applications in harsh environments where a maintenance-free cooling system is required. Finally, the heat sink is relatively affordable, making it a cost-effective option for many applications.

Conclusion

In conclusion, the ATS-05C-10-C3-R0 Heat Sink is a reliable, efficient, and cost-effective way to keep electronic components in a system cool. It operates using a combination of passive cooling, radiation, convection, and conduction to dissipate the heat produced by electronic devices. Additionally, its fan guard provides protection against any objects that may come into contact with the fan blades.

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