| Allicdata Part #: | ATS9406-ND |
| Manufacturer Part#: |
ATS-05C-121-C2-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05C-121-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.56580 |
| 10 +: | $ 3.47130 |
| 25 +: | $ 3.37756 |
| 50 +: | $ 3.18982 |
| 100 +: | $ 3.00220 |
| 250 +: | $ 2.81459 |
| 500 +: | $ 2.72077 |
| 1000 +: | $ 2.43931 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.48°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management has been a key challenge in the development of modern technological products. Heat sinks are a crucial component of managing the thermal output of electronic equipment. The ATS-05C-121-C2-R0 is a convenient, high-performance heat sink designed for various applications. In this article, we’ll discuss the application fields and working principles of the ATS-05C-121-C2-R0 heat sink.
Applications
Begin with the application fields of the ATS-05C-121-C2-R0 heat sink. This heat sink is designed for use in a variety of electronic components such as CPUs, graphics cards, and LED drivers. It’s also ideal for mounting on the power supply boards of 3U and 6U server platforms. The ATS-05C-121-C2-R0 heat sink also comes with flexible installation options, which makes it suitable for various application scenarios.
The ATS-05C-121-C2-R0 heat sink is also commonly used in industrial computers and other low power thermal systems. It is designed to mount onto a CGA sized PCB, so it’s suitable for any device that requires efficient thermal management. This heat sink is designed to provide a reliable long-term thermal solution that ensures the efficient operation of all components within the device.
Working Principle
Now we’ll take a look at the working principle of the ATS-05C-121-C2-R0 heat sink. This heat sink uses a combination of passive and active cooling principles. It features a base which is designed to absorb and dissipate heat from the CPU or other component. The base is then connected to an active cooling fan to ensure that the heat is quickly and efficiently dissipated from the system.
The ATS-05C-121-C2-R0 heat sink is designed to mount directly onto the component itself, which ensures that the heat is efficiently removed from the device. The fan is located at the back of the heat sink and is designed to blow air directly onto the surface of the component to further facilitate heat dissipation. The fan is adjustable and can be adjusted to fit the needs of the application.
This combination of passive and active cooling allows the ATS-05C-121-C2-R0 heat sink to provide a reliable and efficient thermal solution for a variety of components. This makes it ideal for applications in industrial computing, high-end gaming systems, and more.
Conclusion
The ATS-05C-121-C2-R0 heat sink is a reliable and efficient thermal solution for a variety of electronic components. Its combination of passive and active cooling principles allows it to provide a long-term and reliable solution for a variety of applications. Additionally, its flexible installation options make it suitable for any device that requires thermal management.
The specific data is subject to PDF, and the above content is for reference