| Allicdata Part #: | ATS9410-ND |
| Manufacturer Part#: |
ATS-05C-125-C2-R0 |
| Price: | $ 4.24 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05C-125-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.84930 |
| 10 +: | $ 3.74787 |
| 25 +: | $ 3.53934 |
| 50 +: | $ 3.33119 |
| 100 +: | $ 3.12304 |
| 250 +: | $ 2.91483 |
| 500 +: | $ 2.70663 |
| 1000 +: | $ 2.65458 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.92°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are used to dissipate heat from components such as power transistors, resulting in greater operating efficiency and longer life for components. The ATS-05C-125-C2-R0 is a thermal heat sink designed for power management applications. It uses aluminum heat-sink fins and has a proven track record of providing heat-dissipation from high-powered devices.
The ATS-05C-125-C2-R0’s primary application field is in power electronics, especially where large amounts of heat must be quickly discharged. It is formed with aluminum fins arranged in a fan or “common” pattern for maximum heat-transfer efficiency. The fins are 30mm x 40mm and have an additional 15mm bottom plate that helps to evenly distribute the heat. This setup helps with the uniformity of heat absorption and dissipation, allowing for effective temperature management. Furthermore, this heat sink incorporates up to three stages of fin fins for extended service life.
The working principle of the ATS-05C-125-C2-R0 thermal heat sink is based on a natural convection process. Heat is generated by the components of the system, such as transistors, and rises naturally due to the difference in air temperature in the area. The aluminum fins of the heat sink absorb this hot air and act as a heat-balancer, cooling the environment down. The fins present a greater surface area to the environment, so more heat can be absorbed; at the same time, they act as conduits for the hot air to transfer more quickly away from the heat source. This allows for rapid temperature reduction.
In addition, the aluminum fins used in the ATS-05C-125-C2-R0 are designed to generate the low-noise, high-performance cooling which is necessary for power management applications. This is achieved by optimizing the aerodynamic design of the blade fins, allowing for effective convection cooling and a more efficient unit. Since air-flow over the fin is improved by the pressure created by the fan, this allows for greater elevation differences between air temperature levels to be dissipated.
The ATS-05C-125-C2-R0 thermal heat sink is an effective cooling unit for high powered applications. By providing superior convection cooling and optimization of blade and fin design, it is a reliable and long-lasting solution to the problem of heat-discharge in power electronics. Its natural convection process dissipates greater amounts of heat, resulting in a more efficient and reliable system.
The specific data is subject to PDF, and the above content is for reference