| Allicdata Part #: | ATS-05C-131-C1-R0-ND |
| Manufacturer Part#: |
ATS-05C-131-C1-R0 |
| Price: | $ 4.16 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05C-131-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.78252 |
| 30 +: | $ 3.57231 |
| 50 +: | $ 3.36206 |
| 100 +: | $ 3.15195 |
| 250 +: | $ 2.94182 |
| 500 +: | $ 2.73169 |
| 1000 +: | $ 2.67917 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.58°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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!Thermal - Heat Sinks are used in all kinds of electronic applications, ranging from power-supplies to industrial machinery.One such device is the ATS-05C-131-C1-R0. This device is engineered to sink and reduce the heat from an application’s power supply. The device is designed to dissipate up to 48.5 W of power in a variety of applications.
The ATS-05C-131-C1-R0 has an aluminum/steel construction. It is constructed by separating an aluminum core and a steel pot section. The aluminum core works as a heat sink and its fins provide a large surface area to disperse the heat. The pot section works as a heat spreader for distributing the heat evenly throughout the device. The aluminum core is plated with a thermal paste which helps to dissipate heat more efficiently.
The ATS-05C-131-C1-R0 also contains several cooling features. It is equipped with fins that have a high surface area for dispersing the heat, as well as a fan that circulates the air within the device. This fan helps to disperse the heat throughout the device and surrounding environment. Additionally, the device is equipped with a thermoelectric module for use in cooling applications.
The ATS-05C-131-C1-R0 is a versatile device that can be used in a variety of applications. It is suitable for use in high-heat applications, such as power supplies, high-frequency radio systems, telecommunications equipment, and medical electronics. The device can also be used in cooling applications such as domestic refrigerators, refrigerated display cabinets, and industrial production equipment.
The ATS-05C-131-C1-R0 is easy to install and maintain. It is equipped with an adjustable bracket for easy mounting on a variety of mounting surfaces. Additionally, the device is self-contained and requires minimal setup. Maintenance is straightforward and requires minimal effort.
The ATS-05C-131-C1-R0 is an efficient and reliable thermal - heat sink device for dissipating excess heat in all types of applications. Its aluminum/steel construction, cooling features, versatility, and ease of installation and maintenance make it an ideal choice for a wide range of applications.
The specific data is subject to PDF, and the above content is for reference