| Allicdata Part #: | ATS9417-ND |
| Manufacturer Part#: |
ATS-05C-131-C2-R0 |
| Price: | $ 5.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05C-131-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.05260 |
| 10 +: | $ 4.91589 |
| 25 +: | $ 4.64285 |
| 50 +: | $ 4.36968 |
| 100 +: | $ 4.09658 |
| 250 +: | $ 3.82347 |
| 500 +: | $ 3.55036 |
| 1000 +: | $ 3.48209 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.60°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are important components for any application that will be subject to high temperatures. The ATS-05C-131-C2-R0 is a heat sink that is designed to provide efficient cooling with surface mount compatibility.
The ATS-05C-131-C2-R0 is manufactured from a combination of aluminum and copper to ensure optimum thermal performance and reliability. The fins are carefully engineered to be an integral part of the heat sink. The fins increase the air circulation and surface area, providing improved cooling and thermal management.
The ATS-05C-131-C2-R0 is designed for use in high-temperature applications, such as in server and storage components, telecommunications products, and industrial equipment. The heat sink is suitable for a working range of -55°C to +125°C and can also be used in applications that require higher temperatures. This heat sink is available in a variety of different sizes and can be used with either vertical or horizontal mounting.
The key component of the ATS-05C-131-C2-R0 is its heat dissipation mechanism, which is based on a combination of conduction and convection. As the base of the heat sink is exposed to a heated component, the heat is first transferred through the top plate and then into the fins. The heat is then dissipated through the heat pipes to the fins and dissipates into the atmosphere. This mechanism provides an efficient and reliable cooling system that can be used in a wide range of applications.
The ATS-05C-131-C2-R0 is designed to provide superior thermal performance with minimal space requirements. It is also built to offer a low-profile design, making it an ideal choice for applications that require a shallow mounting depth. This heat sink is also capable of dissipating higher temperatures and is available with a wide range of mounting options.
The ATS-05C-131-C2-R0 is one of the most advanced and reliable Thermal - Heat Sinks on the market. It is designed to provide superior cooling and reliability in a wide range of applications. This heat sink is easy to install and can provide superior cooling performance in high-temperature environments. It is ideal for use in server and storage components, telecommunications products, and industrial equipment.
The specific data is subject to PDF, and the above content is for reference