ATS-05C-136-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.756" (70.00mm)
Width:	2.756" (70.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	2.22°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

ATS-05C-136-C3-R0 Thermal - Heat Sinks | Application Field and Working Principle

Thermal - Heat Sinks are an important component of many electronic and electrical systems. The ATS-05C-136-C3-R0 Thermal - Heat Sink is a high-performance device commonly used in applications that require heat dissipation from the devices. This article explains its application fields and working principle.

Application Field

The ATS-05C-136-C3-R0 Thermal - Heat Sink is commonly used in different sectors, such as aerospace, defense, automotive, marine, industrial, medical, consumer, and commercial.The ATS-05C-136-C3-R0 Thermal - Heat Sink is usually used to dissipate high temperatures from high-performance applications, such as semiconductors, LEDs, microcontrollers, processors, etc. It can be used in various environments, such as harsh and extreme climatic conditions.

Working Principle

The ATS-05C-136-C3-R0 Thermal - Heat Sink is extremely efficient in dissipating heat. It works by using the principle of thermal conductivity. This means that, when warm air touches the heat sink, it absorbs the heat and then carries it away as heat energy. The heat sink consists of either aluminum or copper fins on top of a metal base. This combination helps to disperse heat by air convection. The fins may be directed upward or downward and the size and shape of the fins determines the rate of heat transfer. The fins are connected to the base plate with a special thermal adhesive. This ensures that the heat is adequately distributed throughout the device. The ATS-05C-136-C3-R0 Heat Sink has a high thermal conductivity rating, which allows it to transfer heat faster and more efficiently.

Conclusion

The ATS-05C-136-C3-R0 Thermal - Heat Sink is a high-performance device that is widely used in different industries to dissipate heat from electronic and electrical systems. It works on the principle of thermal conductivity by absorbing the heat and then carrying it away as heat energy. The fins of the heat sink are connected to the base plate with a thermal adhesive, and the size and shape of the fins determines the rate of heat transfer. In summary, the ATS-05C-136-C3-R0 Thermal - Heat Sink is an essential component that provides efficient heat transfer in many commercial, industrial and consumer applications.

The specific data is subject to PDF, and the above content is for reference