| Allicdata Part #: | ATS-05C-173-C1-R0-ND |
| Manufacturer Part#: |
ATS-05C-173-C1-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-05C-173-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are essential components used in electronics cooling systems, providing a means to dissipate the heat generated by the electronic devices. The ATS-05C-173-C1-R0 is designed to cool chipsets, microprocessors, and other active components in a variety of applications. Its design provides excellent cooling performance within its size and capacity constraints.
Application Field
The ATS-05C-173-C1-R0 is designed for applications that require a robust, high-performance cooling solution. It is ideally suited for use in applications which require precise thermal regulation, including consumer electronics, networking equipment, medical imaging systems, and server applications. It can also be used in military and automotive applications, where its small size and ability to be mounted onto board makes it ideal for applications which require efficient cooling with minimal space.
Working Principle
The ATS-05C-173-C1-R0 is designed to utilize natural convection cooling mechanisms. This is achieved by taking advantage of the differences between the temperature of the atmosphere and the temperature of the electronic component being cooled. Heat produced by the component is absorbed by the base fin array of the heat sink and conducted away from the device, thus cooling it. As the heat is transferred from the component to the heat sink, it is released into the atmosphere from the heat sink\'s fins. The fins are designed with a specific shape that maximizes the flow of air around them in order to achieve maximum cooling.
The aluminum extrusion used to manufacture the ATS-05C-173-C1-R0 is designed to hold the device securely while permitting maximum heat transfer. The design also includes clip-less mounting brackets that ensure a firm grip and easy installation. The fins are soldered to the base for greater heat transfer and durability.
In addition to its high-performance cooling capabilities, the ATS-05C-173-C1-R0 provides superior design flexibility. It offers a wide range of cooling configurations and sizes, allowing it to be adapted to many different types of cooling applications. The device is also available with a variety of finishes, from matte, to anodized, to nickel-plated, all of which provide superior corrosion resistance. With its superior performance, flexibility, and corrosion resistance, the ATS-05C-173-C1-R0 is an ideal cooling solution for a variety of applications.
The specific data is subject to PDF, and the above content is for reference
ATS-05C-173-C1-R0 Datasheet/PDF