| Allicdata Part #: | ATS-05C-189-C3-R0-ND |
| Manufacturer Part#: |
ATS-05C-189-C3-R0 |
| Price: | $ 4.41 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05C-189-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.96711 |
| 30 +: | $ 3.74703 |
| 50 +: | $ 3.52661 |
| 100 +: | $ 3.30618 |
| 250 +: | $ 3.08577 |
| 500 +: | $ 2.86535 |
| 1000 +: | $ 2.81025 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.82°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
ATS-05C-189-C3-R0 is a thermal management device specifically designed to limit the amount of heat generated by electronic components. It is a type of heat sink that is made from finned aluminum or copper material. It efficiently transports the heat generated by electronic components away from the source and helps maintain the operating temperature of the system.
Application Field
The ATS-05C-189-C3-R0 thermal device is suitable for a variety of applications. It is most commonly used in industrial and automotive electronics, as well as consumer electronics. Due to its thermal management ability, it is a great choice for products that tend to generate a lot of heat such as power amplifiers, audio equipment, computers, and imaging devices.
Working Principle
The ATS-05C-189-C3-R0 thermal device works by transferring the heat away from the source and dissipating it into the atmosphere. It does this by creating a temperature gradient between the cooled component and the surrounding environment. As the component generates heat, the heat is transferred to the ATS-05C-189-C3-R0, where the finned material increases the surface area for greater heat dissipation. The temperatures in the system remain balanced, preventing any additional heat buildup. This ensures that electronics remain cool and function optimally.
The ATS-05C-189-C3-R0 is also designed with safety in mind. The thermal device is designed to provide effective heat dissipation, but it also has added safety features built in. This includes an overload protection feature, a current limiting feature, and an over-temperature feature which ensures that the thermal device does not become overloaded and cause a potential hazard.
Conclusion
The ATS-05C-189-C3-R0 is an effective thermal management device for a variety of applications. It is suitable for industrial and automotive electronics, as well as consumer electronics. It provides effective heat dissipation and also maintains the operating temperature of a system by creating a temperature gradient between the cooled component and the surrounding environment. The thermal device is also designed with safety features, such as overload protection and current limiting features, to ensure that the unit does not become overloaded and cause a potential hazard.
The specific data is subject to PDF, and the above content is for reference