| Allicdata Part #: | ATS-05C-20-C1-R0-ND |
| Manufacturer Part#: |
ATS-05C-20-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05C-20-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-05C-20-C1-R0 is a high-end thermal-heat sink that can be used in various applications in the heating and cooling industry. It has a unique design that allows it to dissipate heat from high-duty electrical and electronic components while preventing the overheating of those devices. This thermal-heat sink uses specialty materials and engineering techniques to maximize its efficiency in dissipating heat. It is suitable for applications in the automotive, computer, industrial, and military industries.
The ATS-05C-20-C1-R0 features a heat sink with an array of heat-dissipating fins made of aluminum alloy. The fins are arranged in a special way to form a honeycomb pattern that maximises the surface area to dissipate the heat quickly. The thermal sinks are mounted on an aluminum base plate with thermal grease or thermal adhesive. This helps the heat sink to effectively transfer heat away from the components. The fins also have a high-temperature powder-coated layer, which improves their heat-dissipating properties.
The ATS-05C-20-C1-R0 has a patented airflow management system that helps to evenly distribute the heated air away from the component being cooled. The airflows through the honeycomb patterned fins, and then is directed towards the heat exchanger. This air flow ensures that the hottest point in the system is the heat exchanger, and not the heat sink itself. The air exchange provides a passive cooling solution by preventing the component from overheating and the system from crashing or malfunctioning.
One of the unique features of the ATS-05C-20-C1-R0 is the patented heat-dissipation plate. This plate has a special coating to maximize the transfer of heat from the component being cooled to the heat sink. The air-exchange system is connected to the heat-dissipation plate by a system of tubes and filters. This ensures that the air flow is uniform and consistent, allowing for maximum performance.
The ATS-05C-20-C1-R0 is suitable for a variety of applications in the heating and cooling industry. It is designed to meet the needs of high duty electrical and electronic components, providing a reliable and efficient cooling solution that prevents overheating and malfunctioning. Its patented airflow management system ensures the hottest point in the system is the heat exchanger, and not the heat sink itself, thereby providing a passive cooling solution. The heat-dissipation plate is unique in its design, maximizing heat transfer from the component being cooled and providing increased performance.
The specific data is subject to PDF, and the above content is for reference