ATS-05C-200-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-05C-200-C3-R0-ND

Manufacturer Part#:

ATS-05C-200-C3-R0

Price: $ 3.81
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X10MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-05C-200-C3-R0 datasheetATS-05C-200-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.45933
30 +: $ 3.36588
50 +: $ 3.17898
100 +: $ 2.99193
250 +: $ 2.80496
500 +: $ 2.71146
1000 +: $ 2.43095
Stock 1000Can Ship Immediately
$ 3.81
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.90°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

  • ATS-05C-200-C3-R0 Application Field
ATS-05C-200-C3-R0 is a thermal-heat sink product from AME Technologies. It is designed as a one-piece aluminum construction which offers a simple yet highly efficient heat dissipation solution. The heat sink has a central cooling fin and is suitable for use in a range of applications, including general industrial equipment, semiconductor processors, data centers, telecommunications, and computer cooling systems.The ATS-05C-200-C3-R0 is also ideal for use in automotive and consumer electronics applications. It can be used to dissipate thermal energy generated from CPUs, GPUs, and other integrated circuits including automotive microprocessors. The ATS-05C-200-C3-R0 is designed to provide reliable and robust performance in a compact, lightweight design. Its low profile allows it to be used in applications where space is limited.
  • Working Principle
The ATS-05C-200-C3-R0 works by using convection. This is the process where heat is transferred from one material to another by the movement of heat energy (in this case hot air) from the hot source to the cooler material (in this case the heat sink). The cooling fins of the ATS-05C-200-C3-R0 draw in cooler air which in turn dissipates the heat energy from the hot source, such as a CPU or GPU.The ATS-05C-200-C3-R0 also utilizes a “Heat Baffle” structure which helps direct the airflow for superior cooling performance. The combination of these two technologies creates an effective cooling solution which dissipates the thermal energy in a efficient manner.The ATS-05C-200-C3-R0 is designed to be used with a variety of fans. This allows users to tailor the noise, airflow, and cooling performance to meet their needs. It can also be used in active cooling solutions which utilize a liquid cooling system. This enables it to handle higher thermal energy loads, while reducing noise levels.Overall, the ATS-05C-200-C3-R0 provides an effective and efficient cooling solution for a range of applications. Its one-piece aluminum construction makes it a robust and reliable option for industrial and consumer electronics. Its low profile and easy installation make it an ideal solution for those limited on space. Finally, its heat baffle design and a variety of fan options make it a great choice for customizing cooling performance.

The specific data is subject to PDF, and the above content is for reference

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