ATS-05C-25-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.362" (60.00mm)
Width:	2.362" (60.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	6.25°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Overview The ATS-05C-25-C1-R0 is a thermal heat sink which provides cooling to components. It is an advanced cooling solution which operates at the most efficient levels of thermal performance. The thermal heat sink is designed to dissipate and reduce the heat generated from components in order to keep them functioning properly. Application Field The ATS-05C-25-C1-R0 is an ideal solution for cooling applications which require the highest levels of heat dissipating performance. It is suitable for high-powered components which generate high amounts of heat such as processors, video cards, memory cards, and other power-consuming components. It is also suitable for components which may require increased cooling due to the installation of overclocking, additional fans, or heat spreaders. Design and Construction The ATS-05C-25-C1-R0 features a copper base with five heat pipes incorporated within. These heat pipes are composed of various materials depending on the application and performance of the thermal heat sink. These materials include copper, aluminum, and other metals which provide maximum heat absorption and dissipation. The design of the thermal heat sink also features a thinly projected aluminum fins which enhance heat absorption and dissipation. The ATS-05C-25-C1-R0 features a proprietary mounting system which utilizes a clip mounting system to attach the heat sink to the component. The system is designed to provide a secure and safe mounting connection which also allows for a quick installation and removal. Working Principle It is important to note that thermal heat sinks such as the ATS-05C-25-C1-R0 operate via an effective principle of heat dissipation. This principle involves the efficient conversion of a heat source, such as the component to be cooled, into a less powerful and dissipating heat source. To do so, the thermal heat sink must be able to absorb and transfer the heat source to another medium. For example, the thermal heat sink absorbs the heat from the component and transfers it to the five heat pipes in its construction. The heat pipes transfer the heat to the aluminum fan where it is then dissipated into the surrounding environment. This process results in the successful conversion of the heat source into a less powerful and dissipating heat source. In conclusion, the ATS-05C-25-C1-R0 is a thermal heat sink which provides cooling to components. It features a copper base and various materials which provide maximum heat absorption and dissipation. Furthermore, this heat sink features a clip mounting system for easy installation and removal. The heat sink operates by absorbing and transferring the heat source to the heat pipes, which ultimately dissipates it into the surrounding environment.

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