ATS-05C-47-C1-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are universally applied in various electronic devices to regulate the temperature of the device. The thermal - heat sinks are mostly made of aluminum and copper alloy. The common application of thermal - heat sinks is to disipate the heat from the electronic devices. The ATS-05C-47-C1-R0 is an example of such a device. This article will provide a brief introduction about its application field and working principle.

The ATS-05C-47-C1-R0 is an advanced thermal - heat sink system made of aluminum, copper alloy and ceramic-based composites. It is especially designed for use in advanced telecommunication systems, computers and electronic equipment applications. This system can deliver better thermal conductivity and high mechanical strength that can tolerate extreme working conditions. It also has superior thermal dissipation performance that can protect the underlying components from heat damage.

The major application area for the ATS-05C-47-C1-R0 is in high-power power supply systems. This system provides a stable and dependable thermal and heat dissipation performance, allowing power supplies to operate at a greater power capacity and with a lower risk of damage to the underlying components. This also makes it ideal for use in high-definition multimedia system, preventing the device from overheating and reducing the risk of system failure.

The basic working principle of the ATS-05C-47-C1-R0 is based on the physics of convection and radiation. The base of the thermal - heat sinks has a series of heat pipes that are connected to a large heat sink. The heat pipes collect and transport the thermal energy from the electronic device to the heat sink. The heat sink then dissipates the heat away from the device, thus regulating its temperature. Additionally, some thermal - heat sinks also feature a series of cooling fans that increase the efficiency of heat dissipation.

The ATS-05C-47-C1-R0 system is also designed to be resistant to dust and moisture. The surface of the heat sink is coated with a special powder that prevents dust and moisture form accumulating on the surface. This coating also helps to provide increased thermal - heat dissipation performance, allowing the device to remain cool for a longer time frame.

In conclusion, the ATS-05C-47-C1-R0 is an advanced thermal - heat sink system for high-power power supply systems. It is designed to provide superior thermal conductivity and mechanical strength, and a dust and moisture resistant coating. By properly applying the ATS-05C-47-C1-R0, the underlying components of the electronic device can be protected from heat damage and the device can be operated safely and with greater reliability. As such, the ATS-05C-47-C1-R0 is an indispensable part of any advanced telecommunication system, computer and electronic equipment application.

The specific data is subject to PDF, and the above content is for reference