| Allicdata Part #: | ATS-05C-61-C1-R0-ND |
| Manufacturer Part#: |
ATS-05C-61-C1-R0 |
| Price: | $ 3.31 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05C-61-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.00762 |
| 30 +: | $ 2.92635 |
| 50 +: | $ 2.76381 |
| 100 +: | $ 2.60127 |
| 250 +: | $ 2.43868 |
| 500 +: | $ 2.35738 |
| 1000 +: | $ 2.11351 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.94°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a crucial consideration for any electronic system. From component cooling to card-level cooling, thermal management allows systems to improve their efficiency and extend the lifespan of components
One of the most important components of a thermal management system is a heat sink. Heat sinks help to dissipate heat away from sensitive components and keep them at a safe operating temperature. ATS-05C-61-C1-R0 is a type of heat sink specifically designed for use with card-level electronic systems. In this article, we\'ll discuss the application field and working principle of ATS-05C-61-C1-R0 heat sinks.
ATS-05C-61-C1-R0 heat sinks are designed for use in various electronic equipment, including computers, servers, storage arrays, telecommunication devices, and networking devices. It is primarily used in systems that require efficient cooling of high-powered components, such as CPUs, GPUs, GPUs, and network processors, that generate a high amount of heat.
The ATS-05C-61-C1-R0 is a high-performance and compact heat sink that provides superior cooling capabilities. It is constructed from a high quality aluminum alloy, which is lightweight yet highly durable. The heat sink has a unique fin design that allows for maximum cooling potential. It features a large surface area for maximum heat dissipation and uses strategically placed pins to maximizes its cooling capacity.
The working principle of the ATS-05C-61-C1-R0 heat sinks is based on the natural laws of thermodynamics. When a heated component is placed in contact with the heat sink, heat is naturally transferred from the component to the heat sink. The heat is then dissipated away from the component as the fins conduct heat away from the component and into the surrounding environment.
The ATS-05C-61-C1-R0 heat sink is designed to provide maximum cooling performance with a minimal amount of space. It can be installed in tight spaces, making it an ideal choice for systems with limited space. It also features a low-profile design that provides a minimal amount of drag, reducing noise levels and improving system efficiency.
The ATS-05C-61-C1-R0 heat sink is ideal for applications where efficient cooling of high-powered components is required. Its dimensions make it suitable for installation in various electronic systems, providing superior heat dissipation with minimal space and noise. From computers to servers to telecommunication devices, the ATS-05C-61-C1-R0 heat sink is a reliable and efficient cooling solution.
The specific data is subject to PDF, and the above content is for reference