
Allicdata Part #: | ATS-05C-65-C1-R0-ND |
Manufacturer Part#: |
ATS-05C-65-C1-R0 |
Price: | $ 4.02 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 40X40X30MM L-TAB |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.65526 |
30 +: | $ 3.45198 |
50 +: | $ 3.24904 |
100 +: | $ 3.04592 |
250 +: | $ 2.84286 |
500 +: | $ 2.63980 |
1000 +: | $ 2.58903 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.575" (40.00mm) |
Width: | 1.575" (40.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.181" (30.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 7.27°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an important part of overall system performance and reliability. Heat sinks are used in a variety of applications including LED lighting, medical equipment, audio, and HVAC systems. The ATS-05C-65-C1-R0 is a tailored heat sink with integrated cooling fins that is designed to efficiently draw heat away from components, helping to maintain necessary operating temperatures.
This heat sink model is designed for use with 65 watts of cooling power and features a thin 11-millimeter profile to help fit into small spaces. It is composed of high-quality die-cast aluminum, and the conduction fins are equipped with coated pins to help optimize heat transfer. It has a variety of mounting options and operates across a wide range of temperatures. The ATS-05C-65-C1-R0 also has the necessary UL listings, making it suitable for international applications.
The ATS-05C-65-C1-R0 can be used as an integral part of any system or device requiring thermal management. This heat sink is suitable for use with a variety of components including motors, electrical drives, circuit boards, and transformers. It is designed to keep components and systems from overheating and ensure optimal performance.
The ATS-05C-65-C1-R0 uses a passive method of cooling, meaning it does not require any additional fans or other active cooling systems. This heat sink utilizes conduction to draw heat away from electrical components, thermally isolating them from the surrounding environment. Heat is transferred from the components to the fins of the device, where it can be dissipated into the air. This heat sink is designed to maximize efficiency, and can help reduce component operating temperatures by up to 50 degrees Celsius.
Heat transfer is greatly assisted by using thermal interface materials, such as a thermal pad or thermal paste. A quality thermal interface material helps bridge the gap between the component and the cooling fin, ensuring optimal heat transfer. Depending on the size, a thermal grease or gel may be needed to help spread the heat evenly across the fins.
The ATS-05C-65-C1-R0 is a reliable and efficient option for any application requiring thermal management. Its ultra-thin profile allows it to fit into tight spaces and its thermally efficient design provides superior heat transfer. With its wide range of mounting options and UL ratings, it can be used for a variety of applications. The ATS-05C-65-C1-R0 can be used with complete confidence to ensure components operate within their recommended temperature ranges.
The specific data is subject to PDF, and the above content is for reference