| Allicdata Part #: | ATS9541-ND |
| Manufacturer Part#: |
ATS-05C-70-C2-R0 |
| Price: | $ 4.97 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05C-70-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.51710 |
| 10 +: | $ 4.39551 |
| 25 +: | $ 4.15120 |
| 50 +: | $ 3.90701 |
| 100 +: | $ 3.66282 |
| 250 +: | $ 3.41863 |
| 500 +: | $ 3.17444 |
| 1000 +: | $ 3.11340 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.70°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A thermal heat sink is a device that is designed to absorb heat from a small area and disperse it over a larger area. Generally, these devices are used to help reduce the overall temperature in an area. The most common application of such devices is in computer cooling systems, where they are used to draw heat away from the processor and other internal components and redistribute it throughout the chassis. The ATS-05C-70-C2-R0 is a type of thermal heat sink that is suitable for a variety of applications. This article will discuss the application field and working principle of the ATS-05C-70-C2-R0 thermal heat sink.
Applications
The ATS-05C-70-C2-R0 is a heat dissipating device that is designed for applications such as high density data centers, server farms, and general industrial cooling. Its rugged design makes it suitable for harsh environments, and its ability to dissipate large amounts of heat makes it ideal for applications where reliable cooling is essential. The ATS-05C-70-C2-R0 can also be used in high-end computer gaming setups, as it is capable of dissipating the heat generated by high performance gaming components.
Working Principle
The ATS-05C-70-C2-R0 thermal heat sink is designed to dissipate heat from a small area over a larger area. This is done by transferring thermal energy from the small area to the larger area through convection. The heat transfer process begins when a cooler air flow passes over the surface of the device. As the air moves over the device, it absorbs the thermal energy from the device, while the cooler air is drawn up and away from the device. This process helps to reduce the overall temperature in the area by drawing away the heat from the device. The ATS-05C-70-C2-R0 is designed to be highly efficient, so that it can keep its cooling performance even in challenging environments.
Conclusion
The ATS-05C-70-C2-R0 is an effective thermal heat sink designed for a variety of applications. Its robust design is suitable for harsh environments, and its ability to effectively dissipate heat makes it ideal for applications where reliable cooling is essential. The device works by transferring thermal energy from a small area to a larger area through convection, making it an effective heat dissipating device. This makes the ATS-05C-70-C2-R0 an ideal choice for anyone looking for an effective and reliable thermal heat sink.
The specific data is subject to PDF, and the above content is for reference