| Allicdata Part #: | ATS-05C-75-C1-R0-ND |
| Manufacturer Part#: |
ATS-05C-75-C1-R0 |
| Price: | $ 3.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05C-75-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.92446 |
| 30 +: | $ 2.84550 |
| 50 +: | $ 2.68733 |
| 100 +: | $ 2.52926 |
| 250 +: | $ 2.37119 |
| 500 +: | $ 2.29216 |
| 1000 +: | $ 2.05503 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.95°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-05C-75-C1-R0 is a device in the family of thermal-heatsinks. It provides a compact, efficient way to dissipate excess heat in systems in which air cooling is not suitable. It has a wide range of applications, from low-power electronic devices to high-performance automotive and military electronics.
The ATS-05C-75-C1-R0 consists of a heatsink body, a top fin, two bottom fins, two mounting clips, a set of screws, and a baseplate. The heatsink body is formed from high-quality aluminum, which is anodized for increased corrosion resistance. The top fin provides a large surface area to dissipate heat, and the bottom fins improve the thermal transfer from the device. The mounting clips are designed to securely attach the heatsink to the device. The baseplate serves as a connection point between the heatsink and the base of the device, and provides additional support and stability.
The working principle of the ATS-05C-75-C1-R0 is based on convection cooling. As the device generates heat, the heat is transferred through the heatsink body and absorbed by the top fin. This heat is then dissipated into the surrounding air. The bottom fins increase the rate of thermal transfer from the device, while the baseplate ensures a secure connection.
The ATS-05C-75-C1-R0 is suitable for a wide range of applications, including consumer electronics, automotive electronics, military electronics, and industrial control systems. It is also an ideal choice for cooling applications that require a compact, lightweight design. The device is also highly reliable, as it is made from durable materials that resist corrosion and reduce the risk of thermal stress.
The ATS-05C-75-C1-R0 is an efficient, reliable, and cost-effective solution for thermal-heatsink applications. It provides an effective way to dissipate heat in systems in which air cooling is not suitable, while providing a durable, lightweight design. The device is suitable for a wide range of applications, from consumer devices to industrial control systems, and is an ideal choice for cooling applications that require a compact, lightweight design.
The specific data is subject to PDF, and the above content is for reference