| Allicdata Part #: | ATS9551-ND |
| Manufacturer Part#: |
ATS-05C-80-C2-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05C-80-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.38310 |
| 10 +: | $ 3.29301 |
| 25 +: | $ 3.20393 |
| 50 +: | $ 3.02602 |
| 100 +: | $ 2.84798 |
| 250 +: | $ 2.67002 |
| 500 +: | $ 2.58101 |
| 1000 +: | $ 2.31400 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction
The ATS-05C-80-C2-R0 is a thermal-heat sink module designed for high thermal performance applications. It provides an efficient surface area to dissipate heat away from electronic components or systems and optimize overall system performance. The ATS-05C-80-C2-R0 thermal-heat sink can be used in numerous applications that require high thermal performance and lower operating temperatures. This includes server racks, computers, telecommunications, HVAC and industrial electronics.
Application Field
The ATS-05C-80-C2-R0 thermal-heat sink has a variety of applications including servers, servers for cloud computing, information storage systems, gaming consoles, industrial electronics, HVAC and telecommunications equipment. The high thermal performance of the ATS-05C-80-C2-R0 provides improved system performance and reduced component operating temperatures. This makes it suitable for use in high performance equipment, providing improved efficiency and reduced errors. Additionally, the ATS-05C-80-C2-R0 is equipped with adequate heat dissipation technology to suit the needs of various high performance applications.
Working Principle
The ATS-05C-80-C2-R0 thermal-heat sink works by dissipating heat away from the electronic components and systems, using a combination of convection and conduction. The heat is moved from the hot components to the fins of the thermal-heat sink, which then dissipates the heat away. The aluminum fins act as a large surface area for the heat to be efficiently dissipated. The fins also act to provide air circulation, allowing the heat to be dissipated more quickly. The conduction process is aided by the use of a thermal compound, which improves the conduction of heat away from the components. Additionally, the thermal-heat sink is designed to be highly efficient, allowing the processor to run cooler and efficient for longer without risk of overheating.
Conclusion
The ATS-05C-80-C2-R0 thermal-heat sink is a highly efficient thermal-heat sink module that provides improved system performance and better thermal performance. It is suitable for use in a variety of high performance applications. It is designed to dissipate heat away from electronic components and systems, using a combination of convection and conduction. By providing a large surface area and air circulation, the ATS-05C-80-C2-R0 is able to efficiently dissipate heat, allowing components to run cooler and more efficient for longer.
The specific data is subject to PDF, and the above content is for reference